MB1608100Y5X PDF Datasheet

The MB1608100Y5X is MULTILAYER CHIP BEAD. It also consolidates and displays results from multiple manufacturers with the same part number and similar functionality.

Searched parts can be used interchangeably as substitutes for one another, But it's important to note that the parameters for each manufacturer may vary slightly.

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NO	Part No	Descripción	Manufacturers
1	MB1608100Y5x	MULTILAYER CHIP BEAD SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¹¡O D D C B I G PCB Pattern I Unit : m, m Series MB1608 A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 G 0.7 H 0.7	ABC Taiwan Electronics

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Part No	Description	Manufacturers	PDF
MB160	SCHOTTKY DIE SPECIFICATION SCHOTTKY DIE SPECIFICATION Revision 3 5, 25, 2000 Low Ir 60V 1A Single Anode General Description MB160 ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Average Rectified Forward Current Maximum Instantaneous Forward Voltage @ 1 Amperes, 25 0 Ir = 0.1 mA SYM VRRM IFAV VFMAX Spec. Limit 60 1 0.62	FabTech
MB1608xxxx5x	MULTILAYER CHIP BEAD SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¹¡O D D C B I G PCB Pattern I Unit : m, m Series MB1608 A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 G 0.7 H 0.7	ABC Taiwan Electronics
MB1608600Y5x	MULTILAYER CHIP BEAD SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¹¡O D D C B I G PCB Pattern I Unit : m, m Series MB1608 A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 G 0.7 H 0.7	ABC Taiwan Electronics
MB16S	Surface Mount Schottky Bridge Rectifier	GOOD-ARK
MB1608xxxx5x	MULTILAYER CHIP BEAD	ABC Taiwan Electronics
MB1608600Y5x	MULTILAYER CHIP BEAD	ABC Taiwan Electronics
MB1608301Y5x	MULTILAYER CHIP BEAD	ABC Taiwan Electronics

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