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What is MB1608301Y5x?

This electronic component, produced by the manufacturer "ABC Taiwan Electronics", performs the same function as "MULTILAYER CHIP BEAD".


MB1608301Y5x Datasheet PDF - ABC Taiwan Electronics

Part Number MB1608301Y5x
Description MULTILAYER CHIP BEAD
Manufacturers ABC Taiwan Electronics 
Logo ABC Taiwan Electronics Logo 


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Total 4 Pages



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SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
MULTILAYER CHIP BEAD
ABC'S DWG NO.
ABC'S ITEM NO.
MB1608□□□□5
CONFIGURATION & DIMENSIONS
PAGE: 1
A
DD
B
Series
MB1608
A
1.60±0.15
B
0.80±0.15
SCHEMATIC DIAGRAM
C
0.80±0.15
IGI
PCB Pattern
Unit : m/m
D GHI
0.30±0.20
0.7 0.7 0.7
MATERIALS
a Body Ferrite
b Internal conductor Silver or Ag / Pd
c Terminal electrode Ag/Ni/Sn (Lead contant 100ppm max.)
d Remark Lead content 1600ppm typ. include ferrite
a bc
GENERAL SPECIFICATION
a Storage temp. -40 ---- +105
b Operating temp. -25 ---- +85
c Terminal Strength
F
Type
F ( kgf ) time ( sec )
MB1608
0.5
30±5
d Solderability
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5
Flux : Rosin
Dip time : 4±1 seconds
AE-001A
Peak Temp 260 max.
Max time above 230 50sec max.
Max time above 200 70sec max.
Temperature
Rising Area
Preheat Area
+4.0 / sec max.
150 ~ 200 / 60 ~ 120sec
250
200
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0) / sec max.
Peak Temperature:
260
50sec max.
230
150
70sec max.
100
50
0 50 100 150 200 250
Time ( seconds )


Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for MB1608301Y5x electronic component.


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Featured Datasheets

Part NumberDescriptionMFRS
MB1608301Y5xThe function is MULTILAYER CHIP BEAD. ABC Taiwan ElectronicsABC Taiwan Electronics

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