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Datasheet WS512K8 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | Category |
1 | WS512K8 | 512Kx8 SRAM MODULE / SMD 5962-92078 WS512K8-XCX
HI-RELIABILITY PRODUCT
512Kx8 SRAM MODULE, SMD 5962-92078
FIG. 1
PIN CONFIGURATION TOP VIEW
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND
FEATURES
s Access Times 20, 25, 35, 45ns s Standard Microcircuit Drawing, 5962-92078 s MIL-STD-883 Compliant Devices Available s Rad To | ETC | ram |
2 | WS512K8-XCX | 512Kx8 SRAM MODULE / SMD 5962-92078 WS512K8-XCX
HI-RELIABILITY PRODUCT
512Kx8 SRAM MODULE, SMD 5962-92078
FIG. 1
PIN CONFIGURATION TOP VIEW
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND
FEATURES
s Access Times 20, 25, 35, 45ns s Standard Microcircuit Drawing, 5962-92078 s MIL-STD-883 Compliant Devices Available s Rad To | ETC | ram |
WS5 Datasheet ( Hoja de datos ) - resultados coincidentes |
N.º | Número de pieza | Descripción | Fabricantes | Catagory |
1 | WS512K16-xxx | 512Kx16 SRAM MODULE White Electronic Designs
512Kx16 SRAM MODULE
FEATURES
Access Times 17, 20, 25, 35ns MIL-STD-883 Compliant Devices Available Packaging • 44 pin Ceramic SOJ (Package 102) • 44 lead Ceramic Flatpack (Package 209) Organized as two banks of 256Kx16 Data Byte Control: Lower Byte (LB#) = I/O1-8 Upper B White Electronic Designs Corporation ram | | |
2 | WS512K32 | 512K X 32 SRAM MODULE SMD 5962-94611 WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. 68 lea ETC ram | | |
3 | WS512K32-XXX | 512K X 32 SRAM MODULE SMD 5962-94611 WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. 68 lea ETC ram | | |
4 | WS512K32BV | 512Kx32 3.3V SRAM MODULE WS512K32BV-XXXE 512Kx32 3.3V SRAM MODULE
FEATURES
s Access Times of 15†, 17, 20ns s MIL-STD-883 Compliant Devices Available s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Pack ETC ram | | |
5 | WS512K32BV-XXXE | 512Kx32 3.3V SRAM MODULE WS512K32BV-XXXE 512Kx32 3.3V SRAM MODULE
FEATURES
s Access Times of 15†, 17, 20ns s MIL-STD-883 Compliant Devices Available s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Pack ETC ram | | |
6 | WS512K32V | 512Kx32 SRAM 3.3V MODULE WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE
FEATURES
s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509)
PRELIMINARY*
s ETC ram | | |
7 | WS512K32V-XXX | 512Kx32 SRAM 3.3V MODULE WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE
FEATURES
s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509)
PRELIMINARY*
s ETC ram | |
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Número de pieza | Descripción | Fabricantes | |
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