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WEDPNF8M721V-1015BI PDF Datasheet

The WEDPNF8M721V-1015BI is 8mx72 Synchronous Dram + 8mb Flash Mixed Module Multi-chip Package. It also consolidates and displays results from multiple manufacturers with the same part number and similar functionality.




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Searched parts can be used interchangeably as substitutes for one another, But it's important to note that the parameters for each manufacturer may vary slightly.

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No Part number Description ( Function ) Manufacturers PDF
1 WEDPNF8M721V-1015BI
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif

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Recommended search results related to WEDPNF8M721V-1015BI

Part No Description ( Function) Manufacturers PDF
WEDPNF8M721V-1015BC   8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX

ETC
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datasheet pdf
WEDPNF8M721V-1015BM   8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX

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[1]    

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