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Datasheet MA4PBL027 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 2 | MA4PBL027 | HMIC Silicon Beam Lead PIN Diode MA4PBL027
HMIC Silicon Beam Lead PIN Diode
Features
• No Wirebonds Required • Rugged Silicon-Glass Construction • Silicon Nitride Passivation • Polymer Scratch and Impact Protection • Low Parasitic Capacitance and Inductance • Ultra Low Capacitance < 40 fF • Excellent RC Product < 0.1 |
 MA-COM |
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| 1 | MA4PBL027 | HMICTM Silicon Beam-Lead PIN Diodes HMICTM Silicon Beam-Lead PIN Diodes
Features
• • • • • • • • • • • Beam-Lead Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch and Impact Protection Low Parasitic Capacitance and Inductance Ultra Low Capacitance < 40 fF E |
 Tyco Electronics |
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