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Datasheet LDBL20 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | LDBL20 | 200mA very low quiescent current linear regulator IC LDBL20
200 mA very low quiescent current linear regulator IC in (0.47x0.47) mm² STSTAMP™ package
Datasheet - production data
Features
Input voltage from 1.5 to 5.5 V Ultra low-dropout voltage (200 mV typ. at
200 mA load) Very low quiescent current (20 µA typ. at
no-load, 0.03 µA t |  STMicroelectronics | regulator |
LDB Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | LDB181GxxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95�  Murata Manufacturing data | | |
| 2 | LDB182G4505C-110 | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | | |
| 3 | LDB182GxxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | | |
| 4 | LDB183GxxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | | |
| 5 | LDB184GxxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | | |
| 6 | LDB211GxxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | | |
| 7 | LDB218xMxxxC-xxx | Chip Multilayer Hybrid Baluns Microwave Components
03.02.28
Chip Multilayer Hybrid Baluns
Chip Multilayer Hybrid Baluns
2.00±0.1 (3) (2) (1) 1.25±0.1 0.20±0.1 (6) (4) (5) 0.30±0.1 0.35±0.1 0.65±0.05 0.30+0.1/-0.2
: : : :
1.6±0.1 (3) (2) (1) Directional Input Mark 0.15±0.10 0.8±0.1
0.6±0.1
0.95� Murata Manufacturing data | |
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