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PDF UPGT801-S Data sheet ( Hoja de datos )
| Número de pieza | UPGT801-S | |
| Descripción | LED | |
| Fabricantes | Seoul Semiconductor | |
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Hay una vista previa y un enlace de descarga de UPGT801-S (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Specification
UPGT801-S
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 00
September 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
1 page  
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Pd
IF
IFM *2
VR
Topr
Tstg
123
30
90
5
-40 ~ +100
-40 ~ +100
mW
mA
mA
V
oC
oC
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
[2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio.
[3] LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
3. Electric characteristics
Parameter
Forward Voltage
Reverse Current
Luminance Intensity *1
Peak Wavelength
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle *2
Symbol
VF
IR
IV
λP
λd
Δλ
2θ ½
Condition
IF =20mA
VR=5V
IF =20mA
IF =20mA
IF =20mA
IF =20mA
IF =20mA
Min
1.7
-
12
-
554
-
-
Typ Max Unit
2.2 2.7
V
- 10 μA
17 36 mcd
557 - nm
562 567 nm
30 - nm
120 - deg.
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 00
September 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
5 Page 
9. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 4 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Silver plating might be tarnished in the environment that contains corrosive gases
and materials. Also any product that has tarnished lead might be decreased the
solder-ability and optical-electrical properties compare to normal ones.
Please do not expose the product in the corrosive environment during the storage.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(6) Quick cooling shall be avoided.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products.
(9) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(10) When the LEDs are illuminating, operating current should be decided after considering
the ambient maximum temperature.
(11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 00
September 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UPGT801-S.PDF ] | |
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