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PDF USB3740B Data sheet ( Hoja de datos )
| Número de pieza | USB3740B | |
| Descripción | High Speed USB 2.0 Switch | |
| Fabricantes | Microchip | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de USB3740B (archivo pdf) en la parte inferior de esta página. Total 19 Páginas | ||
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USB3740B
High Speed USB 2.0 Switch with ESD Protection
and Low Standby Current
Features
• High Speed USB Mux for multiplexing the USB
lanes between different functions
- Switch the USB connector between two dif-
ferent functions
- Up to 1GHz Bandwidth
• USB Port ESD Protection (DP/DM)
- 8kV HBM
• flexPWRTM Technology
- 30nA Active/Standby Current
- Extremely low power design ideal for battery
powered applications
• Control inputs accommodate 1.8V to 5V inputs
• DP/DM tolerate up to 5.5V
• -40°C to +85°C Operating Temperature
• 10-pin, QFN, RoHS compliant package;
(1.3mm x 1.8mm x 0.55mm height, 0.4mm pitch)
• 10-pin, QFN, RoHS compliant package;
(1.6mm x 2.1mm x 0.55mm height, 0.5mm pitch)
• Automotive option
Block Diagram
USB3740B
DP
HS USB
DM Switch
VDD
VDD
GND
DP_2
DM_2
DP_1
DM_1
OE_N
S
USB 2.0 PHY,
DP Processor, or
Accessory
DM
DP
USB 2.0 PHY,
DM Processor, or
Accessory
Processor
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 1
1 page  
USB3740B
2.0 PIN LAYOUT
2.1 Pin Diagram
The USB3740B is available in both a 0.4mm pitch QFN (1.3mm x 1.8mm x 0.55mm height) and 0.5mm pitch QFN
(1.6mm x 2.1mm x 0.55mm height) package. The 0.5mm pitch package can be ordered in standard or automotive con-
figurations. For additional ordering information, refer to the Product Identification System section.
FIGURE 2-1:
USB3740B PACKAGE DIAGRAM
OE_N
S
VDD
3
4
5
10 DP
9 DM
8 GND
2.2 Ball/Pin Definitions
The following table details the ball/pin definitions for the package diagram above.
Pin
Name
Type/
Direction
Description
10
DP
Analog
USB Mux Output
9 DM Analog
2
DP_1
Analog
USB Mux Input 1
1
DM_1
Analog
6
DP_2
Analog
USB Mux Input 2
7
DM_2
Analog
8
GND
Analog
Ground
5
VDD
Analog
Power
4 S Digital Input Switch control. Refer to Table 4-1.
3
OE_N
Digital Input Active low switch Output Enable. Refer to Table 4-1.
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 5
5 Page 
USB3740B
FIGURE 6-3:
10-PIN, 1.3MM X 1.8MM QFN PACKAGE LAND PATTERN
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X
20
C2
G1
1
2
G2
Y1
E
Y2
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X10)
X
Contact Pad Length (X6)
Y1
Contact Pad Length (X4)
Y2
Contact Pad to Pad (X6)
G1
Contact Pad to Pad (X4)
G2
MIN
0.20
0.20
MILLIMETERS
NOM
0.40 BSC
1.10
1.70
MAX
0.20
0.70
0.80
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2386A
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 11
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet USB3740B.PDF ] | |
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