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PDF LCB717STR Data sheet ( Hoja de datos )

Número de pieza LCB717STR
Descripción Single-Pole Normally Closed OptoMOS Relay
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! LCB717STR Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS DIVISION
Parameter
Load Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
30
1.5
0.3
2
Units
VP
Arms / ADC
mA
Features
1.5A Load Current
0.3Max On-Resistance
2mA Control Current
3750Vrms Input/Output Isolation
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Small 6-Pin Package
Tape & Reel, Surface Mount Version Available
Applications
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
LCB717
Single-Pole, Normally Closed
OptoMOS® Relay
Description
LCB717 is a single-pole normally closed
(1-Form-B) solid state relay that uses optically
coupled technology to provide an enhanced
3750Vrms isolation barrier between the input and the
output of the relay. The efficient MOSFET switches
use IXYS Integrated Circuits Division's patented
OptoMOS architecture. The optically coupled output
is controlled by a highly efficient GaAlAs infrared
LED.
Approvals
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1175739
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LCB717
LCB717S
LCB717STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
1
+ Control
2
– Control
3
Do Not Use
6
Load
5
Do Not Use
4
Load
DC Only Configuration
1
+ Control
2
– Control
3
Do Not Use
6
5
4
+ Load
– Load
Pb
DS-LCB717-R01
e3
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
90%
ton
www.ixysic.com
1

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LCB717STR pdf
INTEGRATED CIRCUITS DIVISION
LCB717
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
LCB717 / LCB717S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
LCB717 / LCB717S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R01 www.ixysic.com
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