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PDF TMP121AQDBVREP Data sheet ( Hoja de datos )
| Número de pieza | TMP121AQDBVREP | |
| Descripción | ACCURATE DIGITAL TEMPERATURE SENSOR | |
| Fabricantes | Burr-Brown Corporation | |
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BurrĆBrown Products
from Texas Instruments
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
1.5°C ACCURATE DIGITAL TEMPERATURE SENSOR WITH SPI™ INTERFACE
FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Extended Temperature Performance of -40°C
to 125°C
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree (1)
• Digital Output: SPI-Compatible Interface
• Resolution: 12-Bit + Sign, 0.0625°C
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
• Accuracy: ±1.5°C from –25°C to 85°C (max)
• Low Quiescent Current: 50 µA (max)
• Wide Supply Range: 2.7 V to 5.5 V
• Tiny SOT23-6 Package
• Operation to 150°C
APPLICATIONS
• Power-Supply Temperature Monitoring
• Computer Peripheral Thermal Protection
• Notebook Computers
• Battery Management
• Environmental Monitoring
DESCRIPTION
The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package.
Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2°C
of accuracy over a temperature range of –40°C to 125°C. Low supply current and a supply range from 2.7 V to
5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer,
consumer, environmental, industrial, and instrumentation applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
1 page  
www.ti.com
APPLICATION INFORMATION
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
The TMP121 and TMP123 are 12-bit plus sign read-only digital temperature sensors optimal for thermal
management and thermal protection applications. The TMP121 and the TMP123 communicate through a serial
interface that is SPI-compatible. Temperature is converted to a 12-bit plus sign data word with 0.0625°C
resolution. The TMP121 and TMP123 are specified for a temperature range of –40°C to 125°C, with operation
extending from –55°C to 150°C.
The TMP121 and TMP123 are optimal for low power applications, with a 0.5 s conversion period for reduced
power consumption. The TMP121 and TMP123 are specified for a supply voltage range of 2.7 V to 5.5 V, and
also feature a hardware shutdown to provide additional power savings.
The TMP121 and TMP123 require no external components for operation, though a 0.1-µF supply bypass
capacitor is recommended. Figure 5 shows typical connections for the TMP121 and TMP123.
V+ V+
SCK 4
3
1
SO 6 TMP121
5
0.1µF
NC(1)
CS
SCK 4
3
2
SO 6 TMP123
5
21
NC = No Connection
0.1µF
NC(1)
CS
GND
GND
NOTE: Pins labeled NC should be left floating or connected to GND.
Figure 5. Typical Connections of the TMP121 and TMP123
The sensing device of both the TMP121 and TMP123 is the chip itself; the die flag of the lead frame is thermally
connected to pin 2 of the TMP121 and of the TMP123. Thermal paths run through the package leads as well as
the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal
path. The GND pin (pin 2) of the TMP121 and the NC pin (pin 2) of the TMP123 are thermally connected to the
metal lead frame and are the best choice for thermal input.
To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to
isolate the package and leads from ambient air temperature.
5
5 Page 
www.ti.com
PACKAGE MATERIALS INFORMATION
9-Oct-2013
*All dimensions are nominal
Device
TMP121AQDBVREP
Package Type Package Drawing Pins
SOT-23
DBV
6
SPQ
3000
Length (mm) Width (mm) Height (mm)
210.0
185.0
35.0
Pack Materials-Page 2
11 Page | ||
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| PDF Descargar | [ Datasheet TMP121AQDBVREP.PDF ] | |
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