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PDF 10XS4200 Data sheet ( Hoja de datos )
| Número de pieza | 10XS4200 | |
| Descripción | 10 mOhm High Side Switch | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Freescale Semiconductor
Advance Information
Document Number: MC10XS4200
Rev. 2.0, 6/2012
Dual 24 V, 10 mOhm High Side
Switch
10XS4200
The 10XS4200 device is part of a 24 V dual high side switch product
family with integrated control, and a high number of protective and
diagnostic functions. It has been designed for truck, bus, and industrial
applications. The low RDS(ON) channels (<10 mΩ) can control different
load types; bulbs, solenoids, or DC motors. Control, device
configuration, and diagnostics are performed through a 16-bit serial
peripheral interface (SPI), allowing easy integration into existing
applications.
Both channels can be controlled individually by external or internal
clock signals, or by direct inputs. Using the internal clock allows fully
autonomous device operation. Programmable output voltage slew-
rates (individually programmable) helps improve electromagnetic
compatability (EMC) performance. To avoid shutting off the device
upon inrush, while still being able to closely track the load current, a
dynamic over-current threshold profile is featured. Switching current of
each channel can be sensed with a programmable sensing ratio.
Whenever communication with the external microcontroller is lost, the
device enters a Fail-safe operation mode, but remains operational,
controllable, and protected.
HIGH SIDE SWITCH
FK SUFFIX (PB-FREE)
98ASA00428D
23 PIN PQFN (12 X12 mm)
Features
• Two fully protected 10 mΩ (@ 25 °C) high side switches
• Up to 6.0 A steady state current per channel
• Separate bulb and DC motor latched over-current handling
• Individually programmable internal/external PWM clock signals
• Over-current, short-circuit, and over-temperature protection with
programmable autoretry functions
• Accurate temperature and current sensing
• Open-load detection (channel in OFF and ON state), also for LED
applications (7.0 mA typ.)
• Normal operating range: 8.0 - 36 V, extended range: 6.0 - 58 V
• 3.3 V and 5.0 V compatible 16-bit SPI port for device control,
configuration and diagnostics at rates up to 8.0 MHz
VDD
VDD
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MC10XS4200FK
-40 to 125 °C
23 PQFN
VPWR
I/O
I/O
SCLK
CSB
SI
MCU I/O
SO
I/O
I/O
I/O
A/D
A/D
GND
10XS4200
VDD VPWR
CLOCK
FSB
SCLK
CSB
HS0
SO
RSTB
SI HS1
IN0
IN1
CONF0
CONF1
FSOB
SYNC
CSNS GND
LOAD
M LOAD
Figure 1. Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2012. All rights reserved.
Free Datasheet http://www.datasheet4u.com/
1 page  
PIN ASSIGNMENT
Table 1. 10XS4200 Pin Description (continued)
The function of each pin is described in the section Functional Description
Pin
Number
Pin Name
Function
Formal Name
Definition
11
SCLK
Input
Serial Clock
This input pin is to be connected to an external SPI Clock signal. The SCLK
pin is internally connected to a pull-down current source IDWN
12
SI Input
Serial Input
This input pin receives the SPI input data from an external device (micro-
controller or another extreme switch device in case of daisy-chaining). The SI
pin is internally connected to a pull-down current source IDWN
13
VDD
Power Digital Drain Voltage This is the positive supply pin of the SPI interface.
16
SO
Output
Serial Output
This output pin transmits SPI data to an external device (external micro-
controller or the SI pin of the next SPI device in case of daisy-chaining). The
pin doesn’t require external pull-up or pull-down resistors, but a series resistor
is recommended to limit current consumption in case of GND disconnection
14, 17, 22 GND
Ground
Ground
These pins, internally connected, are the ground pins for the logic and analog
circuitry. It is recommended to also connect these pins on the PCB.
15,18,21 VPWR
Power
Positive Power Supply These pins, internally connected, supply both the device’s power and control
circuitry (except the SPI port). The drain of both internal MOSFET switches is
connected to them. Pin 15 is the device’s primary thermal pad.
19 HS1 Output Power Switch Outputs Output pins of the switches, to be connected to the load.
20 HS0
23
SYNC
Output
Output Current
This output pin is asserted (logic low) when the Current Sense (CS) output
Monitoring
signal is within the specified accuracy range. Reading the SYNC pin allows the
Synchronization external microprocessor to synchronize to the device when operating in
autonomous operating mode. SYNC is open-drain and requires a pull-up
resistor to VDD.
Analog Integrated Circuit Device Data
Freescale Semiconductor
10XS4200
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Unless specified otherwise: 8.0 V ≤ VPWR ≤ 36 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V. Typical values are
average values evaluated under nominal conditions TA = 25 °C, VPWR = 28 V & VDD = 5.0 V, unless specified otherwise.
parameter
Symbol
Min Typ Max Unit
ELECTRICAL CHARACTERISTICS OF THE OUTPUT STAGE (HS0 AND HS1) (CONTINUED)
ESR0 Output Current Sensing Error (%, uncompensated(16) at output
current level (Sense ratio CSR0 selected):
TJ=-40 °C
6.0 A
3.0 A
1.5 A
0.75 A
TJ=125 °C
6.0 A
3.0 A
1.5 A
0.75 A
TJ=25 to 125 °C
6.0 A
3.0 A
1.5 A
0.75 A
ESR0_ERR
-13
-12
-17
-31
-10
-9.0
-12
-19
-10
-9.0
-12
-22
ESR0 Output Current Sensing Error (% after offset compensation(17) at
output current level (Sense ratio CSR0 selected):
TJ=-40 °C
6.0 A
3.0 A
1.5 A
0.75 A
TJ=125 °C
6.0 A
3.0 A
1.5 A
0.75 A
TJ=25 to 125 °C
6.0 A
3.0 A
1.5 A
0.75 A
ESR0_ERR(Comp)
-10
-10
-10
-10
-9.0
-8.0
-8.0
-9.0
-9.0
-8.0
-8.0
-9.0
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
%
13
12
17
31
10
9.0
12
19
10
9.0
12
22
%
10
10
10
10
9.0
8.0
8.0
9.0
9.0
8.0
8.0
9.0
Notes:
16. ESRx_ERR=(ICSNS_MEAS / ICSNS_MODEL) -1, with ICSNS_MODEL = (I(HS[x])+ I_LOAD_ERR_SYS) * CSRx , (I_LOAD_ERR_SYS defined above, see
section Current Sense Error Model). With this model, load current becomes: I(HS[x]) = ICSNS / CSRx - I_LOAD_ERR_SYS
17. See note (16), but with ICSNS_MEAS obtained after compensation of I_LOAD_ERR_RAND (see Activation and Use of Offset Compensation).
Further accuracy improvements can be obtained by performing a 1- or 2 point calibration.
Analog Integrated Circuit Device Data
Freescale Semiconductor
10XS4200
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet 10XS4200.PDF ] | |
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