1N3019B-1 Datasheet PDF - Microsemi
Part Number | 1N3019B-1 | |
Description | (1N3016B-1 - 1N3045B-1) 1 Watt Glass Case Zener Diodes | |
Manufacturers | Microsemi | |
Logo | ||
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Preview 1 page No Preview Available ! 1N3016B-1 – 1N3045B-1
Available on
commercial
versions
1 Watt Glass Case Zener Diodes
Qualified per MIL-PRF-19500/115
DESCRIPTION
This well established Zener diode series for the 1N3016B-1 through 1N3045B-1 JEDEC
registration in the glass DO-41 package provides a glass hermetic seal for 6.8 to 110 volts. It
is also well suited for high-reliability applications where it is available in JAN, JANTX, and
JANTXV military qualifications. Lower voltages are also available in the 1N3821 through
1N3828 series (3.3 V to 7.5 V) in the same package (see separate data sheet).
Qualified Levels:
JAN, JANTX, and
JANTXV
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• JEDEC registered 1N3016 through 1N3045 numbers.
• Zener voltage range: 6.8 volts to 110 volts.
• Hermetically sealed DO-41 glass package.
• Metallurgically bonded.
• Double plug construction.
• Voltage tolerances of 5%, 2%, and 1% available.
• JAN, JANTX, and JANTXV qualifications also available per MIL-PRF-19500/115.
(See part nomenclature for all available options.)
• RoHS compliant versions available (commercial grade only).
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and temperature range.
• Wide selection from 6.8 to 110 volts.
• Low reverse (leakage) currents.
• Non-sensitive to ESD.
• Inherently radiation hard as described in Microsemi “MicroNote 050”.
DO-41 Package
Also available in:
DO-213AB package
(surface mount)
1N3016BUR-1 –
1N3045BUR-1
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead (1)
DC Power Dissipation (2)
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
TJ and TSTG
R ӨJL
PD
VF
TSP
Value
-55 to +175
80
1.0
1.2
260
Unit
ºC
ºC/W
W
V
oC
Notes: 1. At L = 0.375 inches (10 mm) from body.
2. At T L < +95 oC 3/8” (10 mm) from body or 1.0 watts at T L < +65 oC when mounted on FR4 PC board as
described for thermal resistance above (also see Figure 1). (Derate power to 0 at T L = +175 °C).
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0285, Rev. 1 (121794)
©2013 Microsemi Corporation
Page 1 of 5
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1N3016B-1 – 1N3045B-1
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches. Millimeters are given for general
information only.
2. Package contour optional with BD and length BL. Heat slugs, if any,
shall be included within this cylinder length but shall not be subject to
minimum limit of BD.
3. Within this zone lead, diameter may vary to allow for lead finishes
and irregularities other than heat slugs.
4. In accordance with ASME Y14.5M, diameters are equivalent to Φx
symbology.
DIMENSIONS
Ltr
INCH
MILLIMETERS Notes
Min Max Min Max
BD 0.080 0.107 2.03 2.72
2
BL 0.160 0.205 4.06 5.21
2
LD 0.028 0.034 0.71 0.86
LL 1.000 -
25.40
-
LU - 0.050 - 1.27 3
T4-LDS-0285, Rev. 1 (121794)
©2013 Microsemi Corporation
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