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PDF UPD5759T6J Data sheet ( Hoja de datos )
| Número de pieza | UPD5759T6J | |
| Descripción | Low Noise and High Gain Amplifier IC | |
| Fabricantes | Renesas | |
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μPD5759T6J
Low Noise and High Gain Amplifier IC
for Impedance Converter of Microphone
Preliminary Data Sheet
R09DS0018EJ0100
Rev.1.00
Apr 18, 2011
DESCRIPTION
The μPD5759T6J is a silicon MOS monolithic integrated circuit designed as high gain impedance converter for electret
condenser microphone. This device exhibits low noise and high voltage gain characteristics.
The package is a 3-pin thin-type lead-less minimold, suitable for high-density surface mounting.
FEATURES
• Low noise
: NV = −98 dBV TYP. @VDD = 2.0 V, Cin = 3 pF, RL = 2.2 kΩ
: NV = −99 dBV TYP. @VDD = 2.0 V, Cin = 5 pF, RL = 2.2 kΩ
• High gain
: GV = +9.0 dB TYP. @VDD = 2.0 V, Cin = 3 pF, RL = 2.2 kΩ
: GV = +11.0 dB TYP. @VDD = 2.0 V, Cin = 5 pF, RL = 2.2 kΩ
• Low input capacitance
: Cinput = 2.0 pF TYP. @VDD = 2.0 V, RL = 2.2 kΩ
• Low consumption current
: IDD = 310 μA TYP. @VDD = 2.0 V, RL = 2.2 kΩ
• High-density surface mounting : 3-pin thin-type lead-less minimold (1.2 × 1.0 × 0.33 mm)
• Built-in the capacitor for RF noise immunity
• High ESD voltage
APPLICATIONS
• Microphone, Sensor etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
μPD5759T6J-E4 μPD5759T6J-E4-A 3-pin thin-type
6Z •
lead-less minimold
•
(Pb-Free)
•
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPD5759T6J
Supplying Form
Embossed tape 8 mm wide
Pin 3 face the perforation side of the tape
Qty 10 kpcs/reel
CAUTION
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
R09DS0018EJ0100 Rev.1.00
Apr 18, 2011
Page 1 of 5
Free Datasheet http://www.datasheet4u.com/
1 page  
μPD5759T6J
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Condition Symbol
IR260
WS260
HS350
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0018EJ0100 Rev.1.00
Apr 18, 2011
Page 5 of 5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet UPD5759T6J.PDF ] | |
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