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Número de pieza | SDL1108 | |
Descripción | HIGH CURRENT POWER INDUCTORS | |
Fabricantes | Superworld | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de SDL1108 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! HIGH CURRENT POWER INDUCTORS
SDL1108 SERIES
1. PART NO. EXPRESSION :
SDL1108-R47MF
(a) (b)
(c) (d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : R47 = 0.47uH
(d) Tolerance code : M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
H
B
R47
PCB Pattern
E
Part No.
SDL1108-R47MF
SDL1108-R60MF
SDL1108-1R0MF
SDL1108-1R2MF
SDL1108-1R5MF
SDL1108-2R0MF
mm
A
mm
B
12.0 Max. 12.0 Max.
12.0 Max. 12.0 Max.
12.0 Max. 12.0 Max.
12.5 Max. 12.0 Max.
12.0 Max. 12.0 Max.
12.0 Max. 12.0 Max.
mm
C
8.5 Max.
8.5 Max.
8.5 Max.
8.5 Max.
8.5 Max.
8.5 Max.
mm
D
mm
E
3.4±0.5
5.6±0.5
3.4±0.5
5.6±0.5
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3.4±0.5
6.6±0.5
3.4±0.5
6.6±0.5
3.4±0.5
7.2±0.5
3.4±0.5
6.5±0.5
mm
F
6.7±0.5
6.7±0.5
6.2±0.5
6.2±0.5
6.2±0.5
6.4±0.5
mm
G
5.6±0.5
5.6±0.5
6.6±0.5
6.6±0.5
7.2±0.5
6.5±0.5
mm
H
6.7±0.5
6.7±0.5
6.2±0.5
6.2±0.5
6.2±0.5
6.4±0.5
mm
I
1.8
-0
+0.2
1.8
-0
+0.2
1.5
-0
+0.2
1.5
-0
+0.2
1.4
-0
+0.2
1.2
-0
+0.2
3. SCHEMATIC :
4. MATERIALS :
(a) Core : Ferrite Core
b (b) Wire : Enamelled Copper Wire
a
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
05.05.2008
LTD
PG. 1
1 page HIGH CURRENT POWER INDUCTORS
SDL1108 SERIES
9. SOLDERIND AND MOUNTING :
H
Part No.
SDL1108-R47MF
SDL1108-R60MF
SDL1108-1R0MF
SDL1108-1R2MF
SDL1108-1R5MF
SDL1108-2R0MF
mm
G
5.6±0.5
5.6±0.5
6.6±0.5
6.6±0.5
7.2±0.5
6.5±0.5
mm
H
6.7±0.5
6.7±0.5
6.2±0.5
6.2±0.5
6.2±0.5
6.4±0.5
mm
I
1.8
-0
+0.2
1.8
-0
+0.2
1.5
-0
+0.2
1.5
-0
+0.2
1.4
-0
+0.2
1.2
-0
+0.2
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
d) 1.0mm tip diameter (max)
b) 280°C tip temperature (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
c) Never contact the ceramic with the iron tip
f) Limit soldering time to 3 secs.
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Preheating Soldering
250~260
230
10s max.
180
150
Natural
cooling
Preheating Soldering Natural
cooling
280
260
150
60~120s
30~60s
Figure 1. Re-flow Soldering
Over 1min.
Within 3secs.
Gradual
Cooling
Figure 2. Iron Soldering
10. PACKING AND QUANTITY :
Size
Styrofoam
Inner box
Carton
SDL1108
210
420
2100
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
05.05.2008
LTD
PG. 5
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet SDL1108.PDF ] |
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