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PDF UCLAMP0524P Data sheet ( Hoja de datos )
| Número de pieza | UCLAMP0524P | |
| Descripción | Low Voltage TVS | |
| Fabricantes | Semtech Corporation | |
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PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 5 volts.
The µClampTM0524P is a solid-state device designed
specifically for transient suppression. It is designed to
replace multilayer varistors (MLVs) in portable applica-
tions such as cell phones, notebook computers, and
PDAs. It features large cross-sectional area junctions for
conducting high transient currents. It offers superior
electrical characteristics such as lower clamping voltage
and no device degradation when compared to MLVs.
The µClampTM0524P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV
contact discharge). The “flow-thru” design of the device
results in enhanced ESD performance due to reduced
board trace inductance. The result is lower clamping
voltage and a higher level of protection when compared
to conventional TVS devices.
The µClamp0524P is in an 8-pin, RoHS/WEEE compli-
ant, SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package
makes it ideal for use in portable electronics such as cell
phones, digital still cameras, and notebook computers.
uClamp0524P
Low Voltage TVS
for EwwSwD.DatPaSrheoett4eU.ccotmion
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects four I/O lines
Working voltage: 5V
Flow thru design for easy layout
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP2116P8 package
RoHS/WEEE Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPd
Marking: Orientation Mark and Marking Code
Packaging: Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories
Personal Digital Assistants (PDAs)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Circuit Diagram
Package
18 27 3 6 4 5
2.10
12
1.60
0.50 BSC
GND
Device Schematic
Revision 1/25/2006
0.58
8 Pin SLP package (Bottom Side View)
2.1 x 1.6 x 0.58mm (Nominal)
1 www.semtech.com
1 page  
uClamp0524P
PROTECTION PRODUCTS
Applications Information
Board Layout Comparison to MLVs
Traditionally, single line devices such as MLVs have been
a favorite solution for ESD protection in portable
applications mainly due to their small size. Single-line
solutions, are easy for designers to “sprinkle” around the
board wherever ESD protection is needed. However,
although each MLV takes up a small area on its own,
when used as a multiple-line solution on board, PCB
designers must consider that the total board space that
each device takes up includes not only the package
itself, but also the courtyard, or the “keep-out” area of
the land pattern and the connecting traces. Using 0402
MLV in a 8-line connector protection as an example,
although each 0402 MLV takes up about 0.5mm2, the
total land pattern and courtyard area needed to reflow
the MLVs accurately is about 31.2 mm2. Furthermore,
because each MLV is spaced out from its neighboring
MLVs, the signal traces used to connect from the
connector pins to the each MLV are also spread out, and
therefore, add to the total board area used.
www.DataSheet4U.com
Figure 3 - Layout Example
18
1
The µClamp0524P presents a more compact solution.
Each µClamp0524P integrates 4 TVS in a single, low-
profile SLP package. Using the same example of an 8-
line connector application, only two µClamp0524Ps are
required to protect all 8 lines. While each µclamp0524P
uses about 3.36mm2 in board area, the total area
required for two devices to protect 8 lines, including the
package area and the “keep out” area, is only 17.6mm2.
Comparing to the 31.2 mm2 in area that 8 MLVs need,
two µClamp0524Ps provide a board savings of
approximately 77%! Furthermore, since each
µClamp0524P offers flow-through design, the signal
traces can be routed directly to the devices from the
connector pins without taking extra board space.
Layout using 2 each uClamp0524P requires less than
18mm2 of board space.
2006 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet UCLAMP0524P.PDF ] | |
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