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PDF UCLAMP0506P Data sheet ( Hoja de datos )

Número de pieza UCLAMP0506P
Descripción 6-Line ESD protection Array
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



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No Preview Available ! UCLAMP0506P Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.6mm2 of PCB area and will protect up to six lines.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClamp0506P is in a 6-pin, RoHS/WEEE compliant,
SLP1616P6 package. It measures 1.6 x 1.6 x 0.60mm.
The leads are spaced at a pitch of 0.5mm and are fin-
ished with lead-free NiPdAu. They may be used to meet
the ESD immunity requirements of IEC 61000-4-2, Level
4 (±15kV air, ±8kV contact discharge). The combination
of small size, low capacitance, and high ESD surge capa-
bility makes them ideal for use in portable electronics
such as cell phones, PDAs, notebook computers, and
digital cameras.
uClamp0506P
µClampTM
6-Line ESD prwowwt.eDactatSihoeent4UA.cormray
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Protects six I/O lines
‹ Ultra-small package (1.6 x 1.6 x 0.6mm) requires
less than 2.6mm2 of PCB area
‹ Working voltage: 5V
‹ Low leakage current
‹ Low operating and clamping voltages
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1616P6 6L package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.6 x 1.6 x 0.60 mm
‹ Lead Finish: NiPdAu
‹ Molding compound flammability rating: UL 94V-0
‹ Marking: 0506P
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Cellular Handsets and Accessories
‹ Cordless Phones
‹ Personal Digital Assistants (PDAs)
‹ Portable Instrumentation
‹ Digital Cameras
‹ Peripherals
‹ MP3 Players
Circuit Diagram
PIN Configuration
1 2 3 4 56
1.6
1
6
0.5
1.6
0.6
Center Pad
Revision 04/17/2007
SLP1616P6 (Bottom View)
Nominal Dimensions in mm
1 www.semtech.com

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UCLAMP0506P pdf
µClamp0506P
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
These devices can be configured to protect up to 6
unidirectional data lines or 5 bidirectional lines. The
device is connected as follows:
1. Protection of six I/O lines is achieved by connecting
pins 1, 2, 3, 4, 5, and 6 to the data lines. The
center tab is connected to ground. The ground
connection should be made directly to the ground
plane for best results. The path length is kept as
short as possible to reduce the effects of parasitic
inductance in the board traces.
2. Bidirectional protection of five I/O lines is achieved
by connecting and five pins data lines. The remain-
ing pin is connected to ground. The center pad is
not connected. The ground connection should be
made directly to the ground plane for best results.
The path length is kept as short as possible to
reduce the effects of parasitic inductance in the
board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
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Circuit Diagram
1 2 3 4 56
Center Pad
Pin Configuration (Top Side View)
16
2 Gnd 5
34
Pin
1, 2, 3, 4, 5, 6
Center Tab
Identification
Input/Output Lines
Ground
2007 Semtech Corp.
5
www.semtech.com

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