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PDF UCLAMP0504A Data sheet ( Hoja de datos )

Número de pieza UCLAMP0504A
Descripción 4-Line ESD protection Array
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



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No Preview Available ! UCLAMP0504A Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to four
lines. They are unidirectional devices and may be used
on lines where the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClampTM0504A may be used to meet the immunity
requirements of IEC 61000-4-2, level 4. The small SC-
89 package makes them ideal for use in portable elec-
tronics such as cell phones, PDA’s, notebook comput-
ers, and digital cameras. These devices feature a lead-
free, matte tin lead finish. They are compatible with both
lead free and SnPb assembly techniques.
uClamp0504A
µClampTM
4-Line ESD prwowwt.eDactatSihoeent4UA.cormray
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Protects four I/O lines
‹ Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm)
requires less than 2.9mm2 of PCB area
‹ Working voltage: 5V
‹ Low leakage current
‹ Low operating and clamping voltages
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SC-89 (SOT-666) package
‹ Molding compound flammability rating: UL 94V-0
‹ Marking : Marking Code
‹ Weight: 2.9mg (typical)
‹ Lead Finish: Matte Tin
‹ Packaging : Tape and Reel per EIA 481
Applications
‹ Cellular Handsets & Accessories
‹ Cordless Phones
‹ Personal Digital Assistants (PDA’s)
‹ Notebooks & Handhelds
‹ Portable Instrumentation
‹ Digital Cameras
‹ Peripherals
‹ MP3 Players
Dimensions
Schematic & PIN Configuration
1.70
0.50
0.30
1.25 1.70
0.60
Maximum Dimensions (mm)
Revision 06/23/2004
1
SC-89 (Top View)
www.semtech.com

1 page




UCLAMP0504A pdf
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
unidirectional data lines. The device is connected as
follows:
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 6 to the
data lines. Pins 2 and 5 are connected to ground.
The ground connection should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
uClamp0504A
www.DataSheet4U.com
Circuit Diagram
1 34 6
2, 5
Protection of Four Unidirectional Lines
2004 Semtech Corp.
5
www.semtech.com

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