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Número de pieza | NBXDBA019 | |
Descripción | Clock Oscillator | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! NBXDBA019, NBXHBA019,
NBXSBA019
3.3 V, 125 MHz / 250 MHz
LVPECL Clock Oscillator
The single and dual frequency crystal oscillator (XO) is designed to
meet today’s requirements for 3.3 V LVPECL clock generation
applications. The device uses a high Q fundamental crystal and Phase
Lock Loop (PLL) multiplier to provide selectable 125 MHz or
250 MHz, ultra low jitter and phase noise LVPECL differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1000.
Features
• LVPECL Differential Output
• Uses High Q Fundamental Mode Crystal and PLL Multiplier
• Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)
• Selectable Output Frequency − 125 MHz (default) / 250 MHz
• Hermetically Sealed Ceramic SMD Package
• RoHS Compliant
• Operating Range 3.3 V ±10%
• Total Frequency Stability − $50 PPM
• This is a Pb−Free Device
Applications
• Ethernet, Gigabit Ethernet
• Infiniband
• Base Stations
www.DataSheet4U.com
VDD
6
CLK CLK
54
Crystal
PLL
Clock
Multiplier
1 23
OE
FSEL/NC*
GND
Figure 1. Simplified Logic Diagram
*NBXSBA019 and NBXHBA019 only
http://onsemi.com
MARKING
DIAGRAMS
6 PIN CLCC
LN SUFFIX
CASE 848AB
NBXDBA019
125/250
AWLYYWWG
NBXSBA019
250
AWLYYWWG
NBXHBA019
125
AWLYYWWG
125/250
A
WL
YY
WW
G
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package Shipping†
NBXDBA019LN1TAG CLCC−6
1000/
(Pb−Free) Tape & Reel
NBXSBA019LN1TAG CLCC−6
1000/
(Pb−Free) Tape & Reel
NBXHBA019LN1TAG* CLCC−6
1000/
(Pb−Free) Tape & Reel
NBXDBA019LNHTAG CLCC−6
100/
(Pb−Free) Tape & Reel
NBXSBA019LNHTAG CLCC−6
100/
(Pb−Free) Tape & Reel
NBXHBA019LNHTAG* CLCC−6
100/
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Please contact sales office for availability
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 2
1
Publication Order Number:
NBXDBA019/D
1 page NBXDBA019, NBXHBA019, NBXSBA019
Table 8. RELIABILITY COMPLIANCE
Parameter
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁShock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolderability
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVibration
Solvent Resistance
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁThermal Shock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁMoisture Level Sensitivity
Standard
Mechanical
Mechanical
Mechanical
Mechanical
Environment
Environment
Method
MIL−STD−833, Method 2002, Condition B
MIL−STD−833, Method 2003
MIL−STD−833, Method 2007, Condition A
MIL−STD−202, Method 215
MIL−STD−833, Method 1011, Condition A
MSL1 260°C per IPC/JEDEC J−STD−020D
NBXxxxxxx
Driver
Device
CLK
CLK
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VDD − 2.0 V
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
www.DataSheet4U.com
Temperature (°C)
260
217
temp. 260°C
20 − 40 sec. max.
peak
3°C/sec. max.
6°C/sec. max.
ramp−up
175
150 pre−heat
cooling
reflow
Time
60180 sec.
60150 sec.
Figure 6. Recommended Reflow Soldering Profile
http://onsemi.com
5
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet NBXDBA019.PDF ] |
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