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PDF ISL24021 Data sheet ( Hoja de datos )
| Número de pieza | ISL24021 | |
| Descripción | 1A Rail-to-Rail Input-Output Operational Amplifier | |
| Fabricantes | Intersil Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ISL24021 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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®
Data Sheet
1A Rail-to-Rail Input-Output
Operational Amplifier
The ISL24021 is a high output current, high voltage,
rail-to-rail voltage feedback amplifier. The ISL24021 is
capable of ±1A peak output short circuit current. The
amplifier exhibits beyond the rail input capability, rail-to-rail
output capability and is unity gain stable.
The operating supply voltage range is from 4.5V to 19V
maximum and the ISL24021 can be configured for single or
dual supply operation. The ISL24021 has the ability to
quickly source and sink large peak currents up to ±1A and to
drive large continuous currents of ±300mA.
The ISL24021 features fast slewing and settling times. Also,
the device provides common mode input capability beyond
the supply rails, and rail-to-rail output capability. This enables
the amplifier to offer maximum dynamic range at any supply
voltage. These features make the ISL24021 an ideal solution
as a VCOM driver in TFT-LCD panel applications. Other
applications may include battery power and portable devices,
and especially where low power consumption is important.
The ISL24021 is available in a 8 Ld 3mmx3mm TDFN
package featuring a standard operational amplifier pinout with
a lead pitch of 0.65mm. The device utilizes a thermally
enhanced package and has a built-in thermal protection
circuit. It is specified for operation over an ambient
temperature range of -40°C to +85°C.
Pinout
ISL24021
(8 LD TDFN)
TOP VIEW
NC 1
INN 2
INP 3
VSS 4
THERMAL
PAD
8 NC
7 VDD
6 OUT
5 NC
THERMAL PAD IS ELECTRICALLY
ISOLATED, OR CONNECTED TO VSS
ISL24021
June 3, 2009
FN6637.0
Features
• ±1A Output Short Circuit Current
• 4.5V to 19V Maximum Supply Voltage Range
• 2.0mA Supply Current
• 18V/µs Slew Rate
• 25MHz -3dB Bandwidth
• ±300mA Continuous Output Current
• Unity-Gain Stable
• Beyond the Rails Input Capability
• Rail-to-Rail Output Swing
• Built-in Thermal Protection
• -40°C to +85°C Ambient Temperature Range
• Pb-Free (RoHS Compliant)
Applications
• TFT-LCD Panels
• VCOM Driver
• Video Processing
• Audio Processing
• Active Filters
• Test Equipment
• Battery-Powered Applications
• Portable Equipment
Ordering Information
PART
NUMBER
(Note)
LEAD
PITCH PART PACKAGE PKG.
(mm) MARKING (Pb-Free) DWG. #
ISL24021IRT065Z
0.65 P021
8 Ld TDFN L8.3x3A
ISL24021IRT065Z-T13* 0.65 P021
8 Ld TDFN L8.3x3A
*Please refer to TB347 for details on reel specifications
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL24021
www.TDaytapSihceaetl4UP.ceormformance Curves
500
450
VS = ±5V
TA = +25°C
400
TYPICAL
PRODUCTION
DISTRIBUTION
350
300
250
200
150
100
50
0
-6 -4 -2 0 2 4 6
INPUT OFFSET VOLTAGE (mV)
FIGURE 1. INPUT OFFSET VOLTAGE DISTRIBUTION
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-50
VS = ±5V
0 50 100
TEMPERATURE (°C)
150
FIGURE 2. INPUT OFFSET VOLTAGE vs TEMPERATURE
2.0
1.5 VS = ±5V
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-50
0 50 100
TEMPERATURE (°C)
150
FIGURE 3. INPUT LEAKAGE CURRENT vs TEMPERATURE
4.972
4.970
4.968
VS = ±5V
AV = 1
RL = 1kΩ
4.966
4.964
4.962
4.960
-50
0 50 100
TEMPERATURE (°C)
150
FIGURE 4. OUTPUT HIGH VOLTAGE vs TEMPERATURE
-4.980
-4.982
-4.984
VS = ±5V
AV = 1
RL = 1kΩ
-4.986
-4.988
-4.990
-4.992
-50 0 50 100 150
TEMPERATURE (°C)
FIGURE 5. OUTPUT LOW VOLTAGE vs TEMPERATURE
120
VS = ±5V
110
100
90
80
70
-50
0
50 100
TEMPERATURE (°C)
FIGURE 6. OPEN-LOOP GAIN vs TEMPERATURE
150
5 FN6637.0
June 3, 2009
5 Page 
ISL24021
www.DataSheet4U.com
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD -
TDFN EXPOSED DIEPAD SOLDERED TO PCB
PER JESD51-5
3.0
2.5W
2.5
2.0 TDFN8
θJA = +50 (°C/W)
1.5
1.0
0.5
0
0 25 50 75 100 125 150
AMBIENT TEMP (°C)
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Printed Circuit Board Layout
As with any high-frequency device, good printed circuit
board layout is necessary for optimum performance. For the
ISL24021 low impedance analog power and ground planes
are recommended, and trace lengths should be as short as
possible. The power supply pins must be well bypassed to
reduce the risk of oscillation. For optimal thermal and
operating performance the ISL24021 thermal pad should
always be connected to the lowest potential, VSS.
For normal single supply operation (the VSS pin is
connected to GND) a 4.7µF capacitor should be placed from
VDD to GND, then a parallel 0.1µF capacitor should be
connected as close to the amplifier as possible. For dual
supply operation the same bypassing techniques should be
utilized by connecting capacitors from each supply to GND.
11 FN6637.0
June 3, 2009
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ISL24021.PDF ] | |
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