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PDF UPC8233TK Data sheet ( Hoja de datos )
| Número de pieza | UPC8233TK | |
| Descripción | SiGe:C LOW NOISE AMPLIFIER | |
| Fabricantes | CEL | |
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PRELIMINARY PRODUCT INFORMATION
BIPOLAR ANALOG INTEGRATED CIRCUIT
μPC8233TK
SiGe:C LOW NOISE AMPLIFIER
FOR GPS/MOBILE COMMUNICATIONS
DESCRIPTION
The μPC8233TK is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise
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amplifier for GPS and mobile communications. This device exhibits low noise figure and high power gain
characteristics. This device is suitable for the reduction in power consumption of the mobile communication system
because it operates by low voltage and low current.
The package is 6-pin lead-less minimold, suitable for surface mount.
This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
• Supply voltage
: VCC = 1.7 to 3.3 V (2.7 V TYP.)
• Low noise
: NF = 0.90 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz
NF = 0.90 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz
• High gain
: GP = 20 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz
GP = 19.5 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz
• Low current consumption
: ICC = 3.5 mA TYP. @ VCC = 2.7 V
• Built-in power-saving function
VPSon = 1.0V to Vcc VPSoff = 0.0 to 0.4V
• High-density surface mounting
: 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
• Included very robust bandgap regulator (Small VCC and TA dependence)
• Included protection circuits for ESD
APPLICATION
• Low noise amplifier for GPS and mobile communications
ORDERING INFORMATION
Part Number
Order Number
μPC8233TK-E2 μPC8233TK-E2-A
Package
6-pin lead-less minimold
(1511 PKG) (Pb-Free)
Marking
Supplying Form
TBD • 8 mm wide embossed taping
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPC8233TK
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Document No. (1st edition)
Date Published January 2007 NS CP(N)
© NEC Electronics Corporation 2007
1 page  
μPC8233TK
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
www.DataSheet4U.com Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
IR260
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
5
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