FQP6N60C Datasheet PDF - Fairchild Semiconductor
Part Number | FQP6N60C | |
Description | 600V N-Channel MOSFET | |
Manufacturers | Fairchild Semiconductor | |
Logo | ||
There is a preview and FQP6N60C download ( pdf file ) link at the bottom of this page. Total 10 Pages |
Preview 1 page No Preview Available ! FQP6N60C/FQPF6N60C
600V N-Channel MOSFET
QFET®
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
www.DataSheet4U.com planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.
Features
• 5.5A, 600V, RDS(on) = 2.0Ω @VGS = 10 V
• Low gate charge ( typical 16 nC)
• Low Crss ( typical 7 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
D
!
GDS
TO-220
FQP Series
GD S
TO-220F
FQPF Series
G!
●
◀▲
●
●
!
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
VDSS
Drain-Source Voltage
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM Drain Current - Pulsed
(Note 1)
VGSS
Gate-Source Voltage
EAS Single Pulsed Avalanche Energy
(Note 2)
IAR Avalanche Current
(Note 1)
EAR Repetitive Avalanche Energy
(Note 1)
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD Power Dissipation (TC = 25°C)
- Derate above 25°C
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature.
FQP6N60C FQPF6N60C
600
5.5 5.5 *
3.3 3.3 *
22 22 *
± 30
300
5.5
12.5
4.5
125 40
1.0 0.31
-55 to +150
300
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/°C
°C
°C
Thermal Characteristics
Symbol
RθJC
RθCS
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
FQP6N60C
1.0
0.5
62.5
FQPF6N60C
3.2
--
62.5
Units
°C/W
°C/W
°C/W
©2004 Fairchild Semiconductor Corporation
Rev. A, March 2004
|
|
Typical Characteristics (Continued)
www.DataSheet4U.com
100
D =0 .5
0 .2
1 0 -1
0 .1
0 .0 5
0 .0 2
0 .0 1
1 0 -2
s in gle p ulse
※ N otes :
1.
2.
3.
DZ θuJtCy(
TJM -
t) = 1.00 ℃ /W M a
Fa
TC
ct
=
or,
PD
MD*=Zt1θ/tJ2C
(
t
)
x
.
PDM
t1
t2
1 0 -5
1 0 -4
1 0 -3
1 0 -2
1 0-1
100
101
t1, S quare W ave P ulse D uration [sec]
Figure 11-1. Transient Thermal Response Curve for FQP6N60C
D =0.5
100
0 .2
0.1
0.05
1 0-1
0 .0 2
0.01
1 0-2
1 0 -5
s in gle pu ls e
※ N otes :
1.
2.
3.
ZDθuJtCy(
T JM -
t) = 3.2
Factor,
TC = PD
℃ /W
MD*=Zt 1θ/
t
Max
2
JC
(
t
)
.
PDM
t1
t2
1 0-4
1 0 -3
1 0 -2
1 0-1
100
t1, S quare W ave P ulse D uration [sec]
101
Figure 11-2. Transient Thermal Response Curve for FQPF6N60C
©2004 Fairchild Semiconductor Corporation
Rev. A, March 2004
Preview 5 Page |
Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for FQP6N60C electronic component. |
Information | Total 10 Pages | |
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