FDS2734 Datasheet PDF - Fairchild Semiconductor
Part Number | FDS2734 | |
Description | N-Channel MOSFET | |
Manufacturers | Fairchild Semiconductor | |
Logo | ||
There is a preview and FDS2734 download ( pdf file ) link at the bottom of this page. Total 6 Pages |
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FDS2734
N-Channel UItraFET Trench® MOSFET
250V, 3.0A, 117mΩ
tm
Features
Max rDS(on) =117mΩ at VGS =10V, ID = 3.0A
Max rDS(on) =126mΩ at VGS = 6V, ID = 2.8A
Fast switching speed
High performance trench
low rDS(on)
technology for
extremely
High power and current handling capability
General Descriptions
This single N-Channel MOSFET is produced using
Fairchild Semiconductor’s advanced UItraFET Trench®
process that has been especially tailored to minimize
the on-state resistance and yet maintain superior switching
performance.
Application
DC-DC conversion
RoHS compliant
D
D
D
D
SO-8
Pin 1
G
S
S
S
www.DataSheet4U.com
5
6
7
8
4
3
2
1
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
Parameter
VDS Drain to Source Voltage
VGS Gate to Source Voltage
ID
Drain Current -Continuous
-Pulsed
(Note 1a)
EAS Single Pulse Avalanche Energy
PD
Power dissipation
Power dissipation
(Note 3)
(Note 1a)
(Note 1b)
TJ, TSTG
Operating and Storage Junction Temperature Range
Ratings
250
±20
3.0
50
12.5
2.5
1.0
-55 to 150
Thermal Characteristics
RθJA
RθJA
RθJC
Thermal Resistance, Junction- to -Ambient
Thermal Resistance, Junction- to- Ambient
Thermal Resistance, Junction -to- Case
(Note 1a)
(Note 1b)
(Note 1)
50
125
25
Package Marking and Ordering Information
Device Marking
FDS2734
Device
FDS2734
Package
SO-8
Reel Size
13’’
Tape Width
12mm
Units
V
V
A
mJ
W
oC
oC/W
Quantity
2500 units
©2006 Fairchild Semiconductor Corporation
FDS2734 Rev. B
1
www.fairchildsemi.com
|
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Typical Characteristics TJ = 25°C unless otherwise noted
4 DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
0.2
0.1 0.1
0.05
0.01
0.02
0.01
PDM
1E-3
1E-4
1E-5
10-4
SINGLE PULSE
10-3
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
10-2 10-1 100
t, RECTANGULAR PULSE DURATION(s)
101
102
Figure 13. Transient Thermal Response Curve
Thermal characterization performed using the conditions described in Note 1b
Transient thermal response will change depending on the circuit board design
103
FDS2734 Rev. B
5 www.fairchildsemi.com
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Information | Total 6 Pages | |
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