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PDF NBSG111 Data sheet ( Hoja de datos )

Número de pieza NBSG111
Descripción 2.5V/3.3V SiGe Differential 1:10 Clock/Data Driver
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NBSG111
2.5V/3.3V SiGe Differential
1:10 Clock/Data Driver
with RSECL* Outputs
*Reduced Swing ECL
Description
The NBSG111 is a 1to10 differential clock/data driver. The
device is functionally equivalent to the LVEP111 device with much
higher bandwidth and lower EMI capabilities.
Inputs incorporate internal 50 W termination resistors (input to VT
pad) and accept NECL (Negative ECL), PECL (Positive ECL),
LVTTL, LVCMOS, CML, or LVDS. Outputs are RSECL (Reduced
Swing ECL), 400 mV.
The Q[0:9] / Q[0:9] outputs have a differential synchronous enable
(EN/EN) pin. The synchronous enable pin is used to avoid a runt clock
pulse when the device is enabled/disabled as can happen with an
asynchronous control. The internal flip flop is clocked on the falling
edge of selected clock (CLK0/CLK0 or CLK1/CLK1), therefore all
associated specification limits are referenced to the negative edge of
the selected clock input.
The VBB and VMM pins are internally generated voltage supplies
available
or PECL
to this
inputs
device only. The VBB
and the VMM pin is
is used for singleended NECL
used for LVCMOwwSw.DiantapSuhetest4.U.Fcomor
singleended input operation, the unused differential input is
connected to VBB or VMM as a switching reference voltage. VBB or
VMM may also rebias AC coupled inputs. When used, decouple VBB
and VMM via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB and VMM outputs should be left open.
Features
Maximum Input Clock Frequency > 6 GHz Typical
Maximum Input Data Rate > 6 Gb/s Typical
300 ps Typical Propagation Delay
60 ps Typical Rise and Fall Times
RSPECL Output with Operating Range: VCC = 2.375 V to
3.465 V with VEE = 0 V
RSNECL Output with RSNECL or NECL Inputs with
Operating Range: VCC = 0 V with VEE = 2.375 V to 3.465 V
RSECL Output Level (400 mV PeaktoPeak Output), Differential
Output
50 W Internal Input Termination Resistors
Compatible with Existing 2.5 V/3.3 V LVEP and EP Devices
VBB and VMM Reference Voltage Output
http://onsemi.com
MARKING
DIAGRAM*
SG
111
LYW
FCBGA49
BA SUFFIX
CASE 489A
SG111
L
Y
W
= Device Code
= Wafer Lot
= Year
= Work Week
*For further details, refer to Application Note
AND8002/D
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
January, 2007 Rev. 8
1
Publication Order Number:
NBSG111/D

1 page




NBSG111 pdf
NBSG111
Table 4. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor, R2
(CLK0, CLK0, CLK1, CLK1, SEL, SEL, EN, EN)
Internal Input Pullup Resistor, R1 (CLK0, CLK1, SEL, EN)
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity (Note 3)
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Value
75 kW
36.5 kW
> 2 kV
> 100 V
> 1 kV
Level 3
UL 94 V0 @ 0.125 in
479
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VCC
VI
VEE
VINPP
IOUT
Positive Power Supply
Positive Input
Negative Input
Negative Power Supply
Differential Input Voltage |CLK CLK|
Output Current
VEE = 0 V
VEE = 0 V
VCC = 0 V
VCC = 0 V
VCC VEE w 2.8 V
VCC VEE t 2.8 V
Continuous
Surge
VI  VCC
VI  VEE
3.6
3.6
3.6
3.6
2.8
|VCC VEE|
25
50
V
V
V
V
V
V
mA
mA
IIN Input Current Through RT (50 W Resistor) Static
Surge
45 mA
80 mA
IBB VBB Sink/Source
IMM VMM Sink/Source
TA Operating Temperature Range
Tstg Storage Temperature Range
qJA
Thermal Resistance (JunctiontoAmbient) 0 LFPM
(Note 4)
500 LFPM
49 FCBGA
49 FCBGA
1
1
40 to +70
65 to +150
67
57
mA
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (JunctiontoCase)
2S2P (Note 4)
49 FCBGA
2 to 4
°C/W
Tsol Wave Solder
< 15 sec.
225 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard 516, multilayer board 2S2P (2 signal, 2 power).
http://onsemi.com
5

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NBSG111 arduino
NBSG111
PACKAGE DIMENSIONS
FCBGA49
BA SUFFIX
PLASTIC 8x8 mm (1.0 mm pitch) BGA FLIP CHIP PACKAGE
CASE 489A02
ISSUE A
A
BD
ÉÉÉÉTERMINAL A1 CORNER
E
A
A2
Z
4X
0.15 C
D1
e
DETAIL A
Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M−1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE C.
4. DATUM C (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
6. 489A−01 OBSOLETE, NEW STANDARD 489A−02.
MILLIMETERS
DIM MIN MAX
A −−− 1.40
A1 0.3 0.5
A2 0.91 REF
b 0.40 0.60
D 8.00 BSC
D1 6.00 BSC
E 8.00 BSC
E1 6.00 BSC
e 1.00 BSC
e
E1
A
B 49 X b NOTE 3
C 0.15 M C A B
D 0.08 M C
NOTE 5
0.20 C
NOTE 4 C
7 65 43 21
VIEW ZZ
E
F
G
SEATING
PLANE
0.12 C
A1
49 X DETAIL A
(ROTATED 90_ C.W.)
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
http://onsemi.com
11
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NBSG111/D

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