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What is GS8161E36?

This electronic component, produced by the manufacturer "GSI", performs the same function as "(GS8161E18 - GS8161E36) Sync Burst SRAMs".


GS8161E36 Datasheet PDF - GSI

Part Number GS8161E36
Description (GS8161E18 - GS8161E36) Sync Burst SRAMs
Manufacturers GSI 
Logo GSI Logo 


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GS8161E18(T/D)/GS816132(D)/GS816136(T/D)
100-Pin TQFP & 165-Bump BGA 1M x 18, 512K x 32, 512K x 36
Commercial Temp
Industrial Temp
18Mb Sync Burst SRAMs
250 MHz133 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline
operation
• Dual Cycle Deselect (DCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP and 165-bump BGA
packages
Functional Description
Applications
The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) is a
18,874,368-bit high performance synchronous SRAM with a 2-bit
burst address counter. Although of a type originally developed for
Level 2 Cache applications supporting high performance CPUs, the
device now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control inputs
(ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are
synchronous and are controlled by a positive-edge-triggered clock
input (CK). Output enable (G) and power down control (ZZ) are
asynchronous inputs. Burst cycles can be initiated with either ADSP
or ADSC inputs. In Burst mode, subsequent burst addresses are
generated internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or interleave order
with the Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the user
via the FT mode pin (Pin 14). Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the Data
Output Register. Holding FT high places the RAM in Pipeline mode,
activating the rising-edge-triggered Data Output Register.
DCD Pipelined Reads
The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) is a DCD
(Dual Cycle Deselect) pipelined synchronous SRAM. SCD (Single
Cycle Deselect) versions are also available. DCD SRAMs pipeline
disable commands to the same degree as read commands. DCD
RAMs hold the deselect command for one full cycle and then begin
turning off their outputs just after the second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable (BW)
input combined with one or more individual byte write signals (Bx).
In addition, Global Write (GW) is available for writing all bytes at one
time, regardless of the Byte Write control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High) of
the ZZ signal, or by stopping the clock (CK). Memory data is retained
during Sleep mode.
Core and Interface Voltages
The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) operates on
a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V
compatible. Separate output power (VDDQ) pins are used to decouple
output noise from the internal circuits and are 3.3 V and 2.5 V
compatible.
Parameter Synopsis
Pipeline
3-1-1-1
3.3 V
2.5 V
Flow Through
2-1-1-1
3.3 V
2.5 V
tKQ
tCycle
Curr (x18)
Curr (x36)
Curr (x18)
Curr (x36)
tKQ
tCycle
Curr (x18)
Curr (x36)
Curr (x18)
Curr (x36)
-250 -225 -200 -166 -150 -133 Unit
2.5 2.7 3.0 3.4 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.7 7.5 ns
280 255 230 200 185 165 mA
330 300 270 230 215 190 mA
275 250 230 195 180 165 mA
320 295 265 225 210 185 mA
5.5 6.0 6.5 7.0 7.5 8.5 ns
5.5 6.0 6.5 7.0 7.5 8.5 ns
175 165 160 150 145 135 mA
200 190 180 170 165 150 mA
175 165 160 150 145 135 mA
200 190 180 170 165 150 mA
Rev: 2.13 11/2004
1/36
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 1999, GSI Technology

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GS8161E36 equivalent
GS8161E18(T/D)/GS816132(D)/GS816136(T/D)
165 Bump BGA—x18 Commom I/O—Top View (Package D)
1 2 3 4 5 6 7 8 9 10 11
A NC A E1 BB NC E3 BW ADSC ADV A A18 A
B NC A E2 NC BA CK GW G ADSP A NC B
C NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPA C
D
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
D
E
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
E
F
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
F
G
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
G
H FT MCL NC VDD VSS VSS VSS VDD NC NC ZZ H
J DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
J
K DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
K
L DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
L
M DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
M
N
DQPB NC VDDQ VSS
NC
NC
NC VSS VDDQ NC
NC
N
P
NC NC
A
A TDI A1 TDO A
A
A A17
P
R LBO NC A A TMS A0 TCK A A A A
R
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 2.13 11/2004
5/36
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 1999, GSI Technology


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