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Número de pieza | 1N472xAP | |
Descripción | (1N4728AP - 1N4764AP) Zener Diodes | |
Fabricantes | Microsemi | |
Logotipo | ||
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No Preview Available ! 1N4728AP thru 1N4764AP (PLASTIC)www.DataSheet4U.com
Silicon 1 Watt Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
The popular 1N4728AP thru 1N4764AP series of 1.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 100 volts in 5% tolerances with
other tighter tolerances also available as identified by different suffix letters
in the part number. These plastic encapsulated Zeners are moisture
classified as Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. These plastic molded Zeners with a P suffix provide a
lower thermal resistance compared to the glass-body (G suffix) option for
these same JEDEC part numbers. Both package options are available by
Microsemi. Microsemi also offers numerous other Zener products to meet
higher and lower power and test current applications.
APPEARANCE
DO-41 or
DO-204AL
(Plastic)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
• JEDEC registered 1N4728A to 1N4764A
• Extensive voltage selection from 3.3 to 100 V
• Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and JANS
are available by adding MQ, MX, MV, or MSP
prefixes respectively to part numbers.
• Surface mount equivalents available as
SMAJ4728A to SMAJ4764A and MLL4728A to
MLL4764A (consult factory for others)
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and
temperature range
• Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Flexible axial-lead mounting terminals
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Moisture classification is Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RATINGS
• Power dissipation at 25ºC: 1.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+150ºC
• Thermal Resistance: 45 ºC/W junction to lead at
3/8 (10 mm) lead length from body, or 105ºC/W
junction to ambient when mounted on FR4 PC
board (1 oz Cu) with 4 mm2 copper pads and
track width 1 mm, length 25 mm
• Steady-State Power: 1.0 watts at TL < 105oC 3/8
inch (10 mm) from body or at TA < 45ºC when
mounted on FR4 PC board as described for
thermal resistance above (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to be
operated with the banded end positive with respect to
the opposite end for Zener regulation
• MARKING: Part number
• TAPE & REEL option: Standard per EIA-296 (add
“TR” suffix to part number)
• WEIGHT: 0.7 grams
• See package dimensions on last page
www.DataSheet4U.com
Copyright 2003
8-20-2003 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1 page |
Páginas | Total 3 Páginas | |
PDF Descargar | [ Datasheet 1N472xAP.PDF ] |
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