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What is GS832272?

This electronic component, produced by the manufacturer "ETC", performs the same function as "(GS832218 / GS832236 / GS832272) S/DCD Sync Burst SRAMs".


GS832272 Datasheet PDF - ETC

Part Number GS832272
Description (GS832218 / GS832236 / GS832272) S/DCD Sync Burst SRAMs
Manufacturers ETC 
Logo ETC Logo 


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Preliminary
GS832218(B/E)/GS832236(B/E)/GS832272(C)
119-, 165-, & 209-Pin BGA
Commercial Temp
Industrial Temp
2M x 18, 1M x 36, 512K x 72
36Mb S/DCD Sync Burst SRAMs
250 MHz133 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V +10%/–10% core power supply
• 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-, 165-, and 209-bump BGA package
Functional Description
Applications
The GS832218/36/72 is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter. Although
of a type originally developed for Level 2 Cache applications
supporting high performance CPUs, the device now finds
application in synchronous SRAM applications, ranging from
DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
SCD and DCD Pipelined Reads
The GS832218/36/72 is a SCD (Single Cycle Deselect) and DCD
(Dual Cycle Deselect) pipelined synchronous SRAM. DCD
SRAMs pipeline disable commands to the same degree as read
commands. SCD SRAMs pipeline deselect commands one stage
less than read commands. SCD RAMs begin turning off their
outputs immediately after the deselect command has been
captured in the input registers. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock. The user may
configure this SRAM for either mode of operation using the SCD
mode input.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Core and Interface Voltages
The GS832218/36/72 operates on a 2.5 V or 3.3 V power supply.
All input are 3.3 V and 2.5 V compatible. Separate output power
(VDDQ) pins are used to decouple output noise from the internal
circuits and are 3.3 V and 2.5 V compatible.
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
Parameter Synopsis
-250 -225 -200 -166 -150 -133 Unit
tKQ(x18/x36) 2.5 2.7 3.0 3.5 3.8 4.0 ns
tKQ(x72)
tCycle
3.0 3.0 3.0 3.5 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.7 7.5 ns
Curr (x18)
Curr (x36)
Curr (x72)
285 265 245 220 210 185 mA
350 320 295 260 240 215 mA
440 410 370 320 300 265 mA
tKQ
tCycle
6.5 7.0 7.5 8.0 8.5 8.5 ns
6.5 7.0 7.5 8.0 8.5 8.5 ns
Curr (x18)
Curr (x36)
Curr (x72)
205 195 185 175 165 155 mA
235 225 210 200 190 175 mA
315 295 265 255 240 230 mA
Rev: 1.06 9/2004
1/41
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, GSI Technology

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GS832272 equivalent
Preliminary
GS832218(B/E)/GS832236(B/E)/GS832272(C)
165-Bump BGA—x18 Commom I/O—Top View (Package E)
1 2 3 4 5 6 7 8 9 10 11
A NC A E1 BB NC E3 BW ADSC ADV A A
A
B NC A E2 NC BA CK GW G ADSP A NC B
C NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPA C
D
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
D
E
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
E
F
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
F
G
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
G
H FT MCL NC VDD VSS VSS VSS VDD NC ZQ ZZ H
J DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
J
K DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
K
L DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
L
M DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
M
N
DQPB SCD VDDQ VSS
NC
A
NC VSS VDDQ NC NC
N
P
NC NC
A
A TDI A1 TDO A
A
A
A
P
R LBO A A A TMS A0 TCK A A A A
R
11 x 15 Bump BGA—15 mm x 17 mm Body—1.0 mm Bump Pitch
Rev: 1.06 9/2004
5/41
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, GSI Technology


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Featured Datasheets

Part NumberDescriptionMFRS
GS832272The function is (GS832218 / GS832236 / GS832272) S/DCD Sync Burst SRAMs. ETCETC
GS832272CThe function is 36Mb S/DCD Sync Burst SRAMs. GSI TechnologyGSI Technology

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