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PDF MC74HC1G04 Data sheet ( Hoja de datos )

Número de pieza MC74HC1G04
Descripción Inverter
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! MC74HC1G04 Hoja de datos, Descripción, Manual

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
Inverter
The MC74HC1G04 is a high speed CMOS inverter fabricated with
silicon gate CMOS technology. It achieves high speed operation similar
to equivalent LSTTL while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The MC74HC1G04 output drive current is 1/2 compared to MC74HC
series.
High Speed: tPD = 7ns (Typ) at VCC = 5V
Low Power Dissipation: ICC = 1µA (Max) at TA = 25°C
High Noise Immunity
Balanced Propagation Delays (tpLH = tpHL)
Output Drive Capability: 5 LSTTL
Symmetrical Output Impedance (IOH = IOL = 2mA)
ESD Performance: HBM > 2000V; MM > 200V
Order this document by MC74HC1G04/D
MC74HC1G04
DF SUFFIX
5–LEAD SOT–353 PACKAGE
SC–88A
CASE 419A–01
PROPOSED DT SUFFIX
5–LEAD TSSOP PACKAGE
TSOP5
CASE TBD
NC 1
A2
GND 3
5 VCC
4Y
Figure 1. Pinout (Top View)
FUNCTION TABLE
Inputs
L
H
Outputs
H
L
A1Y
Figure 2. Logic Symbol
H5d
Pin 1
d = Date Code
Marking Diagram
DEVICE ORDERING INFORMATION
Device Order Number
MC74HC1G04DFT1
MC74HC1G04DTT1
Motorola
Circuit
Indicator
MC
MC
Temp
Range
Identifier
74
74
Device Nomenclature
Technology
HC1G
HC1G
Device
Function
04
04
Package
Suffix
DF
DT
Tape and
Reel Suffix
T1
T1
Package Tape and Reel
Type
Size
SC–88A 7–Inch/3000 Unit
TSOP5 7–Inch/3000 Unit
This document contains information on a product under development. Motorola reserves the right to change or
discontinue this product without notice.
06/99
© Motorola, Inc. 1999
1
REV 0.1

1 page




MC74HC1G04 pdf
MC74HC1G04
PROPOSED DT SUFFIX
5–LEAD TSSOP PACKAGE
TSOP5
CASE TBD
ISSUE TBD
A
L
54
S
12 3
B
G
0.05 (0.002)
H
D
M
CJ
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0_ 10_ 0_ 10_
S 2.50 3.00 0.0985 0.1181
DO NOT DESIGN WITH THESE
DIMENSIONS – PRELIMINARY
TSOP5 (5 Pin)
DEVICE
User Direction of Feed
ÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ0.094
2.4
0.037
ÉÉÉÉÉÉ0.95
0.074
1.9
0.037
0.95ÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ
0.039
1.0
0.028
0.7
inches
mm
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
5
MOTOROLA

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