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PDF 74HC541 Data sheet ( Hoja de datos )
| Número de pieza | 74HC541 | |
| Descripción | Inverting Octal 3-STATE Buffer Octal 3-STATE Buffer | |
| Fabricantes | Fairchild | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de 74HC541 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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September 1983
Revised February 1999
MM74HC540 • MM74HC541
Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
General Description
The MM74HC540 and MM74HC541 3-STATE buffers uti-
lize advanced silicon-gate CMOS technology. They pos-
sess high drive current outputs which enable high speed
operation even when driving large bus capacitances.
These circuits achieve speeds comparable to low power
Schottky devices, while retaining the advantage of CMOS
circuitry, i.e., high noise immunity, and low power consump-
tion. Both devices have a fanout of 15 LS-TTL equivalent
inputs.
The MM74HC540 is an inverting buffer and the
MM74HC541 is a non-inverting buffer. The 3-STATE con-
trol gate operates as a two-input NOR such that if either G1
or G2 are HIGH, all eight outputs are in the high-imped-
ance state.
In order to enhance PC board layout, the MM74HC540 and
MM74HC541 offers a pinout having inputs and outputs on
opposite sides of the package. All inputs are protected from
damage due to static discharge by diodes to VCC and
ground.
Features
s Typical propagation delay: 12 ns
s 3-STATE outputs for connection to system buses
s Wide power supply range: 2–6V
s Low quiescent current: 80 µA maximum (74HC Series)
s Output current: 6 mA
Ordering Code:
Order Number Package Number
Package Description
MM74HC540WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
MM74HC540SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC540MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC540N
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
MM74HC541WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
MM74HC541SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC541MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC541N
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
MM74HC540
© 1999 Fairchild Semiconductor Corporation DS005341.prf
Top View
MM74HC541
www.fairchildsemi.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
5 www.fairchildsemi.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet 74HC541.PDF ] | |
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