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PDF 74F821SC Data sheet ( Hoja de datos )

Número de pieza 74F821SC
Descripción 10-Bit D-Type Flip-Flop
Fabricantes National 
Logotipo National Logotipo



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No Preview Available ! 74F821SC Hoja de datos, Descripción, Manual

December 1994
54F 74F821
10-Bit D-Type Flip-Flop
General Description
The ’F821 is a 10-bit D-type flip-flop with TRI-STATE true
outputs arranged in a broadside pinout The ’F821 is func-
tionally and pin compatible with the AMD’s Am29821
Features
Y TRI-STATE Outputs
Y Direct replacement for AMD’s Am29821
Commercial
74F821SPC
74F821SC (Note 1)
Military
54F821SDM (Note 2)
54F821FM (Note 2)
54F821LM (Note 2)
Package
Number
N24C
J24F
M24B
W24C
E28A
Package Description
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Cerpack
24-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX
Note 2 Military grade device with environmental and burn-in processing Use suffix e SDMQB FMQB and LMQB
Logic Symbols
Connection Diagrams
Pin Assignment
for DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9595–1
IEEE IEC
TL F 9595 – 2
TL F 9595 – 3
TL F 9595–5
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9595
RRD-B30M75 Printed in U S A

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74F821SC pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 821 S C X
Temperature Range Family
74FeCommercial FAST
54FeMilitary FAST
Device Type
Package Code
SP e Slim Plastic DIP
SD e Slim Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline (SOIC)
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices ship in 13 reel
Temperature Range
CeCommercial (0 C to a70 C)
MeMilitary (b55 C to a125 C)
5

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