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PDF 74F646 Data sheet ( Hoja de datos )
| Número de pieza | 74F646 | |
| Descripción | Octal Transceiver/Register with TRI-STATE Outputs | |
| Fabricantes | National | |
| Logotipo |  |
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December 1994
54F 74F646 74F646B 54F 74F648
Octal Transceiver Register with TRI-STATE Outputs
General Description
These devices consist of bus transceiver circuits with TRI-
STATE D-type flip-flops and control circuitry arranged for
multiplexed transmission of data directly from the input bus
or from the internal registers Data on the A or B bus will be
clocked into the registers as the appropriate clock pin goes
to a high logic level Control G and direction pins are provid-
ed to control the transceiver function In the transceiver
mode data present at the high impedance port may be
stored in either the A or the B register or in both The select
controls can multiplex stored and real-time (transparent
mode) data The direction control determines which bus will
receive data when the enable control G is Active LOW In
the isolation mode (control G HIGH) A data may be stored
in the B register and or B data may be stored in the A regis-
ter
Features
Y Independent registers for A and B buses
Y Multiplexed real-time and stored data
Y ’F648 has inverting data paths
Y ’F646 ’F646B have non-inverting data paths
Y ’F646B is a faster version of the ’F646
Y TRI-STATE outputs
Y 300 mil slim DIP
Y Guaranteed 4000V minimum ESD protection
Commercial
74F646SPC
74F646SC (Note 1)
74F646MSA (Note 1)
74F646BSPC
74F646BSC (Note 1)
74F648SPC
74F648SC (Note 1)
Military
54F646DM (Note 2)
54F646FM (Note 2)
54F646LM (Note 2)
54F648SDM (Note 2)
54F648FM (Note 2)
54F648LM (Note 2)
Package
Number
N24C
J24F
M24B
MSA24
W24C
E28A
N24C
M24B
N24C
J24F
M24B
W24C
E28A
Package Description
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Molded Shrink Small Outline EIAJ Type II
24-Lead Cerpack
28-Lead Ceramic Leadless Chip Carrier Type C
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Cerpack
24-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbols
’F646 ’F646B
’F648
TL F 9580 – 1
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9580
TL F 9580 – 7
RRD-B30M75 Printed in U S A
1 page  
Logic Diagrams (Continued)
’F648
TL F 9580 – 6
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays
5
5 Page 
Physical Dimensions inches (millimeters) (Continued)
24-Lead Molded Shrink Small Outline Package EIAJ Type II
NS Package Number MSA24
24-Lead (0 300 Wide) Molded Dual-In-Line Package (SP)
NS Package Number N24C
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet 74F646.PDF ] | |
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