74F219PC Datasheet PDF - National
Part Number | 74F219PC | |
Description | 64-Bit Random Access Memory with TRI-STATEE Outputs | |
Manufacturers | National | |
Logo | ||
There is a preview and 74F219PC download ( pdf file ) link at the bottom of this page. Total 8 Pages |
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54F 74F219
64-Bit Random Access Memory with TRI-STATE
Outputs
General Description
The ’F219 is a high-speed 64-bit RAM organized as a
16-word by 4-bit array Address inputs are buffered to mini-
mize loading and are fully decoded on-chip The outputs are
TRI-STATE and are in the high-impedance state whenever
the Chip Select (CS) input is HIGH The outputs are active
only in the Read mode This device is similar to the ’F189
but features non-inverting rather than inverting data out-
puts
Features
Y TRI-STATE outputs for data bus applications
Y Buffered inputs minimize loading
Y Address decoding on-chip
Y Diode clamped inputs minimize ringing
Y Available in SOIC (300 mil only)
Commercial
74F219PC
74F219SC (Note 1)
74F219SJ (Note 1)
Military
54F219DL (Note 2)
54F219FL (Note 2)
54F219LL (Note 2)
Package
Number
N16E
J16A
M16B
M16D
W16A
E20A
Package Description
16-Lead (0 300 Wide) Molded Dual-In-Line
16-Lead Ceramic Dual-In-Line
16-Lead (0 300 Wide) Molded Small Outline JEDEC
16-Lead (0 300 Wide) Molded Small Outline EIAJ
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX and SJX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DLQB FLQB and LLQB
Logic Symbol
Connection Diagrams
Pin Assignment for
DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9500–1
TL F 9500 – 2
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9500
TL F 9500 – 3
RRD-B30M105 Printed in U S A
|
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Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 219 S C X
Temperature Range Family
74F e Commercial
54F e Military
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13 reel
Temperature Range
C e Commercial (0 C to a70 C)
L e Military (b55 C to a100 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
Preview 5 Page |
Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for 74F219PC electronic component. |
Information | Total 8 Pages | |
Link URL | [ Copy URL to Clipboard ] | |
Download | [ 74F219PC.PDF Datasheet ] |
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