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PDF 74F190 Data sheet ( Hoja de datos )

Número de pieza 74F190
Descripción Up/Down Decade Counter with Preset and Ripple Clock
Fabricantes Fairchild 
Logotipo Fairchild Logotipo



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No Preview Available ! 74F190 Hoja de datos, Descripción, Manual

August 1995
54F 74F189 64-Bit Random Access
Memory with TRI-STATE Outputs
General Description
The ’F189 is a high-speed 64-bit RAM organized as a 16-
word by 4-bit array Address inputs are buffered to minimize
loading and are fully decoded on-chip The outputs are TRI-
STATE and are in the high impedance state whenever the
Chip Select (CS) input is HIGH The outputs are active only
in the Read mode and the output data is the complement of
the stored data
Features
Y TRI-STATE outputs for data bus applications
Y Buffered inputs minimize loading
Y Address decoding on-chip
Y Diode clamped inputs minimize ringing
Y Available in SOIC (300 mil only)
Commercial
74F189PC
74F189SC (Note 1)
74F189SJ (Note 1)
Military
54F189DL (Note 2)
54F189FL (Note 2)
54F189LL (Note 2)
Package
Number
N16E
J16A
M16A
M16D
W16A
E20A
Package Description
16-Lead (0 300 Wide) Molded Dual-In-Line
16-Lead Ceramic Dual-In-Line
16-Lead (0 150 Wide) Molded Small Outline JEDEC
16-Lead (0 300 Wide) Molded Small Outline EIAJ
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX and SJX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DLQB FLQB and LLQB
Logic Symbols
Connection Diagrams
Pin Assignment
for DIP SOIC and Flatpak
Pin Assignment
for LCC
IEEE IEC
TL F 9493–1
TL F 9493 – 2
TL F 9493 – 3
TL F 9493–4
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9493
RRD-B30M105 Printed in U S A

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74F190 pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 189 S C X
Temperature Range Family
74FeCommercial
54FeMilitary
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Ceramic Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Special Variations
X e Devices shipped in 13 reels
QB e Military grade with environmental
and burn-in processing shipped
in tubes
Temperature Range
CeCommercial (0 C to a70 C)
LeMilitary (b40 C to a125 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5

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