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PDF MMSD1000LT1 Data sheet ( Hoja de datos )
| Número de pieza | MMSD1000LT1 | |
| Descripción | Switching Diode | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMBD1000LT1/D
™
Switching Diode
Part of the GreenLine™ Portfolio of devices with energy–conserving traits.
This switching diode has the following features:
• Very Low Leakage (≤ 500 pA) promotes extended battery life by decreas-
ing energy waste
• Offered in four Surface Mount package types
• Available in 8 mm Tape and Reel in quantities of 3,000
Applications
• ESD Protection
• Reverse Polarity Protection
• Steering Logic
• Medium–Speed Switching
MMBD1000LT1
MMBD2000T1
MMBD3000T1
MMSD1000T1
Motorola Preferred Devices
MMBD1000LT1
3
1
2
CASE 318-07, STYLE 8
SOT-23 (TO-236AB)
3
CATHODE
1
ANODE
MAXIMUM RATINGS
Rating
Symbol
Value
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
VR
IF
IFM
(surge)
30
200
500
DEVICE MARKING
MMBD1000LT1 = AY
MMBD2000T1 = DH
MMBD3000T1 = XP
MMSD1000T1 = 4K
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Derate above 25°C MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
PD
225
150
1.8
1.2
Thermal Resistance Junction to Ambient
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
RθJA
556
833
Junction and Storage Temperature
TJ, Tstg – 55 to +150
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
GreenLine is a trademark of Motorola, Inc.
Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
Unit
Vdc
mAdc
mA
Unit
mW
mW/°C
°C/W
°C
MMBD2000T1
3
1
2
CASE 419-02, STYLE 2
SC–70/SOT–323
3
CATHODE
1
ANODE
MMBD3000T1
3
2
1
CASE 318D-03, STYLE 2
SC–59
3
CATHODE
2
ANODE
MMSD1000T1
2
1
CASE 425-04, STYLE 1
SOD–123
1
CATHODE
2
ANODE
©MMotootorroollaa, SInmc. 1a9ll9–5Signal Transistors, FETs and Diodes Device Data
1
1 page  
MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MMSD1000LT1.PDF ] | |
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