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PDF 74LVC06A Data sheet ( Hoja de datos )
| Número de pieza | 74LVC06A | |
| Descripción | Hex inverter with open-drain outputs | |
| Fabricantes | Philips | |
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INTEGRATED CIRCUITS
DATA SHEET
74LVC06A
Hex inverter with open-drain
outputs
Product specification
File under Integrated Circuits, IC24
2000 Mar 07
1 page  
Philips Semiconductors
Hex inverter with open-drain outputs
Product specification
74LVC06A
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC DC supply voltage
VI DC input voltage
VO DC output voltage
Tamb
tr,tf
operating ambient temperature
input rise and fall ratios
CONDITIONS
active mode
high-impedance mode
VCC = 1.65 to 2.7 V
VCC = 2.7 to 5.5 V
LIMITS
MIN.
MAX.
1.65
0
0
0
−40
0
0
5.5
5.5
VCC
5.5
+85
20
10
UNIT
V
V
V
V
°C
ns/V
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC DC supply voltage
IIK DC input diode current
VI DC input voltage
IOK DC output clamping diode current
VO DC output voltage
IO
ICC, IGND
Tstg
Ptot
DC output sink current
DC VCC or GND current
storage temperature
power dissipation per package
SO package
TSSOP package
CONDITIONS
VI < 0
note 1
VO < 0
active mode; note 1
high-impedance mode;
note 1
VO = 0 to VCC
MIN.
−0.5
−
−0.5
−
−0.5
−0.5
−
−
−65
MAX.
UNIT
+6.5 V
−50 mA
+6.5 V
−50 mA
VCC + 0.5 V
+6.5 V
50
±100
+150
mA
mA
°C
above 70 °C derate linearly
with 8 mW/K
above 60 °C derate linearly
with 5.5 mW/K
−
−
500 mW
500 mW
Note
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2000 Mar 07
5
5 Page 
Philips Semiconductors
Hex inverter with open-drain outputs
Product specification
74LVC06A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Mar 07
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet 74LVC06A.PDF ] | |
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