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PDF 74LCX245 Data sheet ( Hoja de datos )
| Número de pieza | 74LCX245 | |
| Descripción | Low Voltage Bidirectional Transceiver | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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December 2013
74LCX245
Low Voltage Bidirectional Transceiver with 5V Tolerant
Inputs and Outputs
Features
■ 5V tolerant inputs and outputs
■ 2.3V to 3.6V VCC specifications provided
■ 7.0ns tPD max. (VCC = 3.3V), 10µA ICC max.
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal(1)
■ ±24mA output drive (VCC = 3.0V)
■ Implements proprietary noise/EMI reduction circuitry
■ Latch-up performance exceeds 500mA
■ ESD performance:
– Human body model > 2000V
– Machine model > 200V
■ Leadless DQFN package
Note:
1. To ensure the high-impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value or the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low
voltage (2.5V and 3.3V) VCC applications with capability
of interfacing to a 5V signal environment. The T/R input
determines the direction of data flow through the device.
The OE input disables both the A and B ports by placing
them in a high impedance state.
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Order Number
Package
Number
Package Description
74LCX245WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX245SJ
M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX245BQX(2)
MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
74LCX245MSA
MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX245MTC
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1994 Fairchild Semiconductor Corporation
74LCX245 Rev. 1.11.1
www.fairchildsemi.com
1 page  
Dynamic Switching Characteristics
Symbol
VOLP
VOLV
Parameter
Quiet Output Dynamic Peak VOL
Quiet Output Dynamic Valley VOL
VCC (V)
3.3
2.5
3.3
2.5
Conditions
CL = 50pF, VIH = 3.3V, VIL = 0V
CL = 30pF, VIH = 2.5V, VIL = 0V
CL = 50pF, VIH = 3.3V, VIL = 0V
CL = 30pF, VIH = 2.5V, VIL = 0V
TA = 25°C
Typical
0.8
0.6
–0.8
–0.6
Unit
V
V
Capacitance
Symbol
CIN
COUT
CPD
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
Conditions
VCC = Open, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC, f = 10MHz
Typical
7.0
8.0
25.0
Units
pF
pF
pF
©1994 Fairchild Semiconductor Corporation
74LCX245 Rev. 1.11.1
5
www.fairchildsemi.com
5 Page 
Physical Dimensions (Continued)
Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1994 Fairchild Semiconductor Corporation
74LCX245 Rev. 1.11.1
11
www.fairchildsemi.com
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet 74LCX245.PDF ] | |
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