UPD64MC Datasheet PDF - NEC
Part Number | UPD64MC | |
Description | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION | |
Manufacturers | NEC | |
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MOS INTEGRATED CIRCUIT
µPD63, 63A, 64
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR INFRARED REMOTE CONTROL TRANSMISSION
DESCRIPTION
Equipped with low-voltage 1.8 V operation, a carrier generation circuit for infrared remote control transmission,
a standby release function through key entry, and a programmable timer, the µPD63, 63A, and 64 are suitable for
infrared remote control transmitters.
For the µPD63, 63A and 64, we have made available the one-time PROM product µPD6P4B for program
evaluation or small-quantity production.
FEATURES
• Program memory (ROM)
· µPD63 : 512 × 10 bits
· µPD63A: 768 × 10 bits
· µPD64 : 1002 × 10 bits
• Data memory (RAM): 32 × 4 bits
• Built-in carrier generation circuit for infrared remote control
• 9-bit programmable timer
: 1 channel
• Command execution time
: 8 µs (when operating at fX = 8 MHz: ceramic oscillation)
• Stack level
: 1 level (Stack RAM is for data memory RF as well.)
• I/O pins (KI/O)
: 8 units
• Input pins (KI)
: 4 units
• Sense input pin (S0)
: 1 unit
• S1/LED pin (I/O)
: 1 unit (When in output mode, this is the remote control transmission display
pin.)
• Power supply voltage
: VDD = 1.8 to 3.6 V (when operating at fX = 4 MHz)
VDD = 2.2 to 3.6 V (when operating at fX = 8 MHz)
• Operating ambient temperature : TA = –40 to +85 ˚C
• Oscillator frequency
: fX = 2.4 to 8 MHz
• POC circuit (Mask option)
APPLICATION
Infrared remote control transmitter (for AV and household electric appliances)
Unless otherwise stated, the µPD63 is taken as a representative product in this document.
The information in this document is subject to change without notice.
Document No. U11371EJ3V0DS00 (3rd edition)
Date Published November 1998 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1996
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µPD63, 63A, 64
9. INSTRUCTION SET .................................................................................................................... 30
9.1 Machine Language Output by Assembler ....................................................................................... 30
9.2 Circuit Symbol Description .............................................................................................................. 31
9.3 Mnemonic to/from Machine Language (Assembler Output) Contrast Table ............................... 32
9.4 Accumulator Operation Instructions ............................................................................................... 36
9.5 Input/Output Instructions ................................................................................................................. 39
9.6 Data Transfer Instructions ................................................................................................................ 40
9.7 Branch Instructions .......................................................................................................................... 42
9.8 Subroutine Instructions .................................................................................................................... 43
9.9 Timer Operation Instruction ............................................................................................................. 44
9.10 Others ................................................................................................................................................. 45
10. ASSEMBLER RESERVED WORDS .......................................................................................... 47
10.1 Mask Option Directives ..................................................................................................................... 47
10.1.1 OPTION and ENDOP directives ............................................................................................. 47
10.1.2 Mask option definition directive ............................................................................................... 47
11. ELECTRICAL SPECIFICATIONS ............................................................................................... 48
12. CHARACTERISTIC CURVE (REFERENCE VALUES) .............................................................. 53
13. APPLIED CIRCUIT EXAMPLE ................................................................................................... 55
14. PACKAGE DRAWINGS .............................................................................................................. 56
15. RECOMMENDED SOLDERING CONDITIONS .......................................................................... 58
APPENDIX A. DEVELOPMENT TOOLS ......................................................................................... 59
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD63 SUBSERIES AND OTHER
SUBSERIES.............................................................................................................. 60
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT .......................... 61
5
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Information | Total 68 Pages | |
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