UPD62AMC Datasheet PDF - NEC
Part Number | UPD62AMC | |
Description | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION | |
Manufacturers | NEC | |
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MOS INTEGRATED CIRCUIT
µPD62A
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR INFRARED REMOTE CONTROL TRANSMISSION
DESCRIPTION
Due to its low-voltage 2.0 V operation, on-chip carrier generator for infrared remote control transmission, standby
release function through key entry, and programmable timer, the µPD62A is ideal for infrared remote control
transmitters.
For the µPD62A, the one-time PROM product µPD6P4B has been made available for program evaluation or
small-scale production.
FEATURES
• Program memory (ROM): 512 × 10 bits
• Data memory (RAM): 32 × 4 bits
• On-chip carrier generator for infrared remote control
• 9-bit programmable timer:
1 channel
• Command execution time:
8 µs (when operating at fX = 8 MHz: ceramic oscillation)
• Stack levels:
1 (Stack RAM is also available for data memory RF.)
• I/O pins (KI/O):
8
• Input pins (KI):
4
• Sense input pin (S0)
• S1/LED pin (I/O): When in output mode, this is the remote control transmission display pin.
• Power supply voltage:
VDD = 2.0 to 3.6 V
• Operating ambient temperature: TA = –40 to +85˚C
• Oscillator frequency:
fX = 2.4 to 8 MHz
• POC (Power On Clear) circuit (Mask option)
APPLICATION
Infrared remote control transmitter (for AV and household electrical appliances)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. U14474EJ1V0DS00 (1st edition)
Date Published November 1999 N CP(K)
Printed in Japan
©
1999
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µPD62A
9. INSTRUCTION SET ...................................................................................................................... 30
9.1 Machine Language Output by Assembler ....................................................................................... 30
9.2 Circuit Symbol Description .............................................................................................................. 31
9.3 Mnemonic to/from Machine Language (Assembler Output) Contrast Table ............................... 32
9.4 Accumulator Operation Instructions ............................................................................................... 36
9.5 Input/Output Instructions ................................................................................................................. 39
9.6 Data Transfer Instruction .................................................................................................................. 40
9.7 Branch Instructions .......................................................................................................................... 42
9.8 Subroutine Instructions .................................................................................................................... 43
9.9 Timer Operation Instructions ........................................................................................................... 44
9.10 Others ................................................................................................................................................. 45
10. ASSEMBLER RESERVED WORDS .......................................................................................... 47
10.1 Mask Option Directives .................................................................................................................... 47
10.1.1 OPTION and ENDOP directives ............................................................................................. 47
10.1.2 Mask option definition directive ............................................................................................... 47
11. ELECTRICAL SPECIFICATIONS .............................................................................................. 48
12. CHARACTERISTIC CURVES (REFERENCE VALUES) ........................................................... 52
13. APPLICATION CIRCUIT EXAMPLE .......................................................................................... 53
14. PACKAGE DRAWINGS ............................................................................................................. 54
15. RECOMMENDED SOLDERING CONDITIONS ......................................................................... 55
APPENDIX A. DEVELOPMENT TOOLS ......................................................................................... 56
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD62A AND OTHER SUBSERIES ... 57
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT .......................... 58
Data Sheet U14474EJ1V0DS00
5
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