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PDF UPD4726 Data sheet ( Hoja de datos )

Número de pieza UPD4726
Descripción RS-232 LINE DRIVER/RECEIVER
Fabricantes NEC 
Logotipo NEC Logotipo



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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4726
RS-232 LINE DRIVER/RECEIVER
The µPD4726 is a high-voltage silicon gate CMOS line driver/receiver conforming to EIA/TIA-232-E Standards.
It contains a DC/DC converter and can operate with a +5 V single power supply. In addition, it is also provided with
ancillary functions such as a standby function.
This IC is equipped with four driver circuits and seven receiver circuits and can configure a simple RS-232 interface
circuit with only four external capacitors.
FEATURES
Conforms to EIA/TIA-32-E (old RS-232C) Standards
+5 V single power supply
A standby mode can be set by making the standby pin low to reduce the power dissipation. At this time, the driver
outputs go into a high-impedance state.
Two receiver circuits can operate as inverters without a hysteresis width even in the standby mode. The remaining
five receiver circuits are fixed to the high level.
ORDERING INFORMATION
Part Number
µPD4726GS-BAF
Package
36-pin plastic SSOP (300 mil)
Quality Grade
Standard
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC
Corporation to know the specification of quality grade on the devices and its recommended applications.
Document No. IC-3413 (1st edition)
(O.D.No. IC-8923)
Date Published March 1997 P
Printed in Japan
© 1994

1 page




UPD4726 pdf
µPD4726
ELECTRICAL SPECIFICATIONS (CHIP)
(Unless otherwise specified, Ta = 40 to +85 °C, C1 through C5 = 1 µF)
Parameter
Symbol
Conditions
Circuit current
ICC1 VCC = +5.0 V, no load, RIN pin open,
STBY = H
Circuit current
ICC2 VCC = +5.0 V, RL = 3 k(DOUT),
DIN = GND, RIN, ROUT pins open,
STBY = H
Circuit current in standby
mode (standby mode 1)
ICC3 VCC = +5.0 V, no load,
DIN, RIN pins open, STBY = L, EN = L,
Ta = 25 °C
VCC = +5.0 V, no load,
DIN, RIN pins open, STBY = L, EN = L,
Circuit current in standby
mode (standby mode 2)
ICC4 VCC = +5.0 V, no load,
DIN, RIN pins open, STBY = L, EN = H,
Ta = 25 °C
Input voltage, high
VCC = +5.0 V, no load,
DIN, RIN pins open, STBY = L, EN = H,
Ta = 25 °C
VIH STBY, EN pins,
VCC = +4.5 to +5.5 V
Input voltage, low
VIL STBY, EN pins,
VCC = +4.5 to +5.5 V
Input current, high
IIH STBY pin, VCC = +5.5 V, VI = +5.5 V
Input current, low
IIL STBY pin, VCC = +5.5 V, VI = 0 V
Input current, high
IIH EN pin, VCC = +5.5 V, VI = +5.5 V
Input current, low
Input capacitance
IIL EN pin, VCC = +5.5 V, VI = 0 V
CIN Driver inputs and receiver inputs,
VCC = +5.0 V, vs. GND, f = 1 MHz
Remark TYP. value is a reference value at Ta = 25 °C.
MIN.
2.4
TYP.
MAX.
12
38
9 20
15
9 20
15
0.8
1
40
40
1
10
Unit
mA
mA
µA
µA
µA
µA
V
V
µA
µA
µA
µA
pF
5

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UPD4726 arduino
µPD4726
RECOMMENDED SOLDERING CONDITIONS
Solder and mount the µPD4726 under the following recommended conditions.
Consult NEC for conditions other than those recommended.
µPD4726GS-BAF
Soldering method
Infrared ray reflow
VPS
Wave soldering
Partial heating
Soldering conditions
Peak temperature of package surface: 235 °C,
Reflow time: Within 30 sec (210 °C or higher),
Number of reflow process: 2, Exposure limit: None Note
Peak temperature of package surface: 215 °C,
Reflow time: Within 40 sec (200 °C or higher),
Number of reflow process: 2, Exposure limit: None Note
Solder temperature: 260 °C or lower, Reflow time: Within 10 sec,
Number of reflow process: 1, Exposure limit: None Note
Pin temperature: 300 °C or lower, Time: Within 10 sec,
Exposure limit: None Note
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
Note Exposure limit before soldering after dry-package is opened. Storage condition: 25 °C and relative humidity
at 65 % or less.
Caution Do not use two or more soldering methods in combination (except the partial heating method).
REFERENCE
Document name
Semiconductor Device Mounting Technology Manual
Quality grade on NEC Semiconductor Devices
NEC Semiconductor Device Reliability/Quality Control system
Document No.
IEI-1207
IEI-1209
IEI-1212
11

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