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Número de pieza | UPB584G | |
Descripción | 3 GHz INPUT DIVIDE BY 2 PRESCALER IC FOR DBS TUNERS | |
Fabricantes | NEC | |
Logotipo | ||
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No Preview Available ! DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µPB1508GV
3 GHz INPUT DIVIDE BY 2 PRESCALER IC
FOR DBS TUNERS
µPB1508GV is a 3.0 GHz input divide by 2 prescaler IC for DBS tuner applications. µPB1508GV can make
VHF/UHF band PLL frequency synthesizer apply to DBS/ECS tuners. µPB1508GV is a shrink package version of
µPB584G so that this small package contributes to reduce the mounting space.
µPB1508GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High toggle frequency
: fin = 0.5 GHz to 3.0 GHz
• High-density surface mounting : 8 pin plastic SSOP (175 mil)
• Low current consumption
: 5 V, 12 mA
• Fixed division
: ÷2
APPLICATION
• Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
• DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
PART NUMBER
µPB1508GV-E1
PACKAGE
8 pin plastic SSOP
(175 mil)
MARKING
1508
SUPPLYING FORM
Embossed tape 8 mm wide. Pin 1 is in tape pull-out
direction. 1 000 p/reel.
Remarks To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order: µPB1508GV)
Caution: Electro-static sensitive devices
Document No. P10768EJ2V0DS00 (2nd edition)
Date Published September 1997 N
Printed in Japan
© 1996
1 page TYPICAL CHARACTERISTICS (unless otherwise specified TA = +25°C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
15
No signals
TA = +85 ˚C
10
TA = +25 ˚C
5
TA = –40 ˚C
µPB1508GV
0
0123456
VCC - Supply Voltage - V
INPUT POWER vs. INPUT FREQUENCY
+20
TA = +25 ˚C
+10
VCC = 4.5 to 5.5 V
0
–10
Guaranteed
Operating
Window
–20
VCC = 4.5 to 5.5 V
–30
–40
–50
–60
100
1000
fin - Input Frequency - MHz
4000
INPUT POWER vs. INPUT FREQUENCY
+20
VCC = 4.5 to 5.5 V
+10
TA = –40 ˚C
0 TA = +85 ˚C
–10 TA = +85 ˚C
TA = +25 ˚C
Guaranteed
Operating
Window
–20
–30
TA = +25 ˚C
TA = –40 ˚C
–40
–50
–60
100
1000
fin -Input Frequency - MHz
4000
OUTPUT POWER vs. INPUT FREQUENCY
0
VCC = 5.0 V
–2
Pin = 0 dBm
ZL = 50 Ω
TA = +25 ˚C
–4
TA = +85 ˚C
–6
TA = –40 ˚C
TA = –40 ˚C
–8
TA = +85 ˚C
–10
TA = +25 ˚C
–12
–14
–16
100
1000
fin - Input Frequency - MHz
4000
OUTPUT POWER vs. INPUT FREQUENCY
0
TA = +25 ˚C
Pin = 0 dBm
–2 ZL = 50 Ω
VCC = 5.5 V
–4
–6 VCC = 5.0 V
VCC = 4.5 V
–8
–10
–12
–14
–16
100
1000
fin -Input Frequency - MHz
4000
5
5 Page µPB1508GV
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
µPB1508GV
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 °C,
Hour: within 30 s. (more than 210 °C),
Time: 3 times, Limited days: no.*
Package peak temperature: 215 °C,
Hour: within 40 s. (more than 200 °C),
Time: 3 times, Limited days: no.*
Soldering tub temperature: less than 260 °C,
Hour: within 10 s.,
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 °C,
Hour: within 3 s./pin,
Limited days: no.*
Recommended condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
* It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet UPB584G.PDF ] |
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