UPD78002BGC Datasheet PDF - NEC
Part Number | UPD78002BGC | |
Description | 8-BIT SINGLE-CHIP MICROCOMPUTER | |
Manufacturers | NEC | |
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MOS INTEGRATED CIRCUIT
µPD78001B(A), 78002B(A)
8-BIT SINGLE-CHIP MICROCOMPUTER
DESCRIPTION
The µPD78001B(A)/78002B(A) are products in the µPD78002 subseries within the 78K/0 series.
The µPD78001B(A)/78002B(A) have various peripheral hardware such as timer, serial interface and interrupt
function.
A one-time PROM or EPROM product, the µPD78P014, capable of operating in the same power supply voltage
range as that of the mask ROM product and other development tools is provided.
Functions are described in detail in the following User's Manual, which should be read when carrying out design
work.
µPD78002, 78002Y Series User's Manual: IEU-1334
FEATURES
• The µPD78001B, in comparison with the 78002B, is a higher reliability device, as a result of a more comprehensive
quality assurance program (Refer to Quality Grade on NEC Semiconductor Devices (IEI-1209))
• Large on-chip ROM & RAM
Item
Product Name
µPD78001B(A)
µPD78002B(A)
Program Memory
(ROM)
8K bytes
16K byte
Data Memory
(Internal High-Speed RAM)
256 bytes
384 bytes
Package
• 64-pin plastic shrink DIP (750 mil)
• 64-pin plastic QFP ( 14 mm)
• External memory expansion space: 64K bytes
• Instruction execution time can be varied from high-speed (0.4 µs) to ultra-low-speed (122 µs)
• I/O ports: 53 (N-ch open-drain : 4)
• Serial interface : 1 channel
• Timer: 4 channels
• Operating voltage range : 2.7 to 6.0 V
APPLICATION
Transmission equipment control device, gas detector circuit breaker, safety devices, etc.
The information in this document is subject to change without notice.
Document No. IC-3599
(O.D. No. IC-9078)
Date Published February 1995 P
Printed in Japan
© 1995
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µPD78001B(A), 78002B(A)
CONTENTS
1. PIN CONFIGURATION (TOP VIEW) ..................................................................................................... 6
2. BLOCK DIAGRAM ................................................................................................................................... 9
3. PIN FUNCTIONS ..................................................................................................................................... 10
3.1 PORT PINS ...................................................................................................................................................... 10
3.2 OTHER PINS ................................................................................................................................................... 12
3.3 PIN I/O CIRCUIT AND RECOMMENDED CONNECTION OF UNUSED PINS ...................................... 13
4. MEMORY SPACE .................................................................................................................................... 15
5. PERIPHERAL HARDWARE FUNCTION FEATURES ............................................................................ 16
5.1 PORTS .............................................................................................................................................................. 16
5.2 CLOCK GENERATOR ...................................................................................................................................... 17
5.3 TIMER/EVENT COUNTER .............................................................................................................................. 18
5.4 CLOCK OUTPUT CONTROL CIRCUIT ......................................................................................................... 20
5.5 BUZZER OUTPUT CONTROL CIRCUIT ....................................................................................................... 20
5.6 SERIAL INTERFACES ..................................................................................................................................... 21
6. INTERRUPT FUNCTIONS AND TEST FUNCTIONS .......................................................................... 22
6.1 INTERRUPT FUNCTIONS ............................................................................................................................... 22
6.2 TEST FUNCTIONS .......................................................................................................................................... 25
7. EXTERNAL DEVICE EXPANSION FUNCTIONS ................................................................................. 26
8. STANDBY FUNCTIONS ......................................................................................................................... 26
9. RESET FUNCTION .................................................................................................................................. 26
10. INSTRUCTION SET ................................................................................................................................ 27
11. ELECTRICAL SPECIFICATIONS ............................................................................................................. 30
12. CHARACTERISTIC CURVE (REFERENCE VALUES) ........................................................................... 48
13. PACKAGE DRAWINGS ........................................................................................................................... 52
14. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 56
APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 57
APPENDIX B. RELATED DOCUMENTS ...................................................................................................... 59
5
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