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PDF ILX532A Data sheet ( Hoja de datos )
| Número de pieza | ILX532A | |
| Descripción | 7500-pixel CCD Linear Sensor (B/W) | |
| Fabricantes | Sony Corporation | |
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7500-pixel CCD Linear Sensor (B/W)
ILX532A
Description
The ILX532A is a reduction type CCD linear sensor
developed for high resolution copiers. This sensor
reads A3-size documents at a density of 600DPI, at
high speed.
28 pin DIP (Cer-DIP)
Features
• Number of effective pixels: 7500 pixels
• Pixel size:
7µm × 7µm (7µm pitch)
• Clamp circuit are on-chip
• Signal output phase of two-output
simultaneous-output (alternate-output is available)
• Ultra high sensitivity/Ultra low lag
• Max Data Rate:
40MHz
• Single 12V power supply
• Input Clock Pulse:
CMOS 5V drive
• Package:
28 pin Cer-DIP (400mil)
Block Diagram
Absolute Maximum Ratings
• Supply voltage
VDD 15
• Operating temperature
–10 to +60
• Storage temperature
–30 to +80
V
°C
°C
Pin Configuration (Top View)
φCLP-ODD 1
φRS-ODD 2
φLH-ODD 3
GND 4
VOUT-ODD 5
VGG 6
NC 7
NC 8
φ2-ODD 9
φ1-ODD 10
VDD 11
φROG 12
NC 13
NC 14
1
7500
28 φCLP-EVEN
27 φRS-EVEN
26 φLH-EVEN
25 VDD
24 VOUT-EVEN
23 VDD
22 NC
21 NC
20 φ2-EVEN
19 GND
18 φ1-EVEN
17 VDD
16 GND
15 NC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E98344-PS
1 page  
Clock Timing Chart 2
t4
t5
φROG
φ1
φLH
φ2
t6
t1
Clock Timing Chart 3
φ1
φLH
t7
φ2
t9
φRS
t2
φCLP
t13
t7
t3
t6
t10 t11
t8
t14 t15
t12
ILX532A
VOUT
t16 t17
Clock timing of φ1, φ2, φLH, φRS, φCLP and VOUT at odd or even are the same as timing chart 3 in the case of
alternate output.
–5–
5 Page 
ILX532A
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
Upper ceramic layer 39N
29N
29N
0.9Nm
Low-melting glass
Lower ceramic layer (1)
(2)
(3)
(4)
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
– 11 –
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet ILX532A.PDF ] | |
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