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PDF 74AVC16244 Data sheet ( Hoja de datos )
| Número de pieza | 74AVC16244 | |
| Descripción | 16-bit buffer/line driver; 3-state 3.6 V tolerant | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
74AVC16244
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
Product specification
Supersedes data of 1998 Dec 11
File under Integrated Circuits, IC24
1999 Nov 15
1 page  
Philips Semiconductors
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
Product specification
74AVC16244
handbook, halfpage
1OE 1
1Y0 2
1Y1 3
GND 4
1Y2 5
1Y3 6
VCC 7
2Y0 8
2Y1 9
GND 10
2Y2 11
2Y3 12
3Y0 13
3Y1 14
GND 15
3Y2 16
3Y3 17
VCC 18
4Y0 19
4Y1 20
GND 21
4Y2 22
4Y3 23
4OE 24
48 2OE
47 1A0
46 1A1
45 GND
44 1A2
43 1A3
42 VCC
41 2A0
40 2A1
39 GND
16244
38 2A2
37 2A3
36 3A0
35 3A1
34 GND
33 3A2
32 3A3
31 VCC
30 4A0
29 4A1
28 GND
27 4A2
26 4A3
25 3OE
MNA501
Fig.3 Pin configuration.
1999 Nov 15
handbook, halfpage
nA0
nA1
nA2
nA3
nOE
nY0
nY1
nY2
nY3
MNA502
Fig.4 Logic symbol.
handbook, halfpage
1 1EN
48 2EN
25 3EN
24 4EN
47
11
46
44
43
41
12
40
38
37
36
13
35
33
32
30
14
29
27
26
2
3
5
6
8
9
11
12
13
14
16
17
19
20
22
23
MNA503
Fig.5 IEEE/IEC logic symbol.
5
5 Page 
Philips Semiconductors
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
Product specification
74AVC16244
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Nov 15
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet 74AVC16244.PDF ] | |
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