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What is FDS4080N3?

This electronic component, produced by the manufacturer "Fairchild Semiconductor", performs the same function as "40V N-Channel FLMP PowerTrench MOSFET".


FDS4080N3 Datasheet PDF - Fairchild Semiconductor

Part Number FDS4080N3
Description 40V N-Channel FLMP PowerTrench MOSFET
Manufacturers Fairchild Semiconductor 
Logo Fairchild Semiconductor Logo 


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May 2003
FDS4080N3
40V N-Channel FLMP PowerTrenchMOSFET
General Description
This N-Channel MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers. It has been optimized for
“low side” synchronous rectifier operation, providing an
extremely low RDS(ON) in a small package.
Applications
Synchronous rectifier
DC/DC converter
Features
13 A, 40 V
RDS(ON) = 10.5 m@ VGS = 10 V
High performance trench technology for extremely
low RDS(ON)
High power and current handling capability
Fast switching (Qg = 30 nC )
FLMP SO-8 package: Enhanced thermal
performance in industry-standard package size
Bottom-side
5 Drain Contact
6
7
8
4
3
2
1
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
Parameter
VDSS
VGSS
ID
Drain-Source Voltage
Gate-Source Voltage
Drain Current – Continuous
– Pulsed
(Note 1a)
PD
TJ, TSTG
Power Dissipation for Single Operation
(Note 1a)
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJA Thermal Resistance, Junction-to-Ambient
RθJC Thermal Resistance, Junction-to-Ambient
(Note 1a)
Package Marking and Ordering Information
Device Marking
Device
Reel Size
FDS4080N3
FDS4080N3
13’’
Ratings
40
± 20
13
60
3.9
–55 to +150
40
0.5
Tape width
12mm
Units
V
V
A
W
°C
°C/W
°C/W
Quantity
2500 units
2003 Fairchild Semiconductor Corporation
FDS4080N3 Rev C1 (W)

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FDS4080N3 equivalent
Typical Characteristics
10
ID = 13 A
8
6
VDS = 10V
20V
30V
4
2
0
0 5 10 15 20 25 30 35
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
10 RDS(ON) LIMIT
1
VGS = 10V
SINGLE PULSE
0.1 RθJA = 85oC/W
TA = 25oC
100µs
1ms
10ms
100ms
1s
10s
DC
0.01
0.1
1 10
VDS, DRAIN-SOURCE VOLTAGE (V)
100
Figure 9. Maximum Safe Operating Area.
2500
2000
1500
CISS
f = 1MHz
VGS = 0 V
1000
500
0
0
COSS
CRSS
10 20 30
VDS, DRAIN TO SOURCE VOLTAGE (V)
40
Figure 8. Capacitance Characteristics.
50
40
30
20
10
0
0.01
0.1
SINGLE PULSE
RθJA = 85°C/W
TA = 25°C
1 10
t1, TIME (sec)
100 1000
Figure 10. Single Pulse Maximum
Power Dissipation.
1
0.1
0.01
0.001
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
RθJA(t) = r(t) * RθJA
RθJA = 85 °C/W
P(pk)
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.001
0.01
0.1
1
10 100
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
1000
FDS4080N3 Rev C1 (W)


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