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What is 1N4148-1?

This electronic component, produced by the manufacturer "Microsemi", performs the same function as "Glass Axial Switching Diode".


1N4148-1 Datasheet PDF - Microsemi

Part Number 1N4148-1
Description Glass Axial Switching Diode
Manufacturers Microsemi 
Logo Microsemi Logo 


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1N4148-1
Available on
commercial
versions
Glass Axial Switching Diode
Qualified per MIL-PRF-19500/116
DESCRIPTION
This popular 1N4148-1 JEDEC registered switching/signal diode features internal
metallurgical bonded construction for military grade products per MIL-PRF-19500/116. This
small low capacitance diode, with very fast switching speeds, is hermetically sealed and
bonded into a double-plug DO-35 package. It may be used in a variety of very high speed
applications including switchers, detectors, transient OR'ing, logic arrays, blocking, as well as
low-capacitance steering diodes, etc. Microsemi also offers a variety of other switching/signal
diodes.
Qualified Levels:
JAN, JANTX, and
JANTXV
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
Popular JEDEC registered 1N4148 number.
Hermetically sealed glass construction.
Metallurgically bonded.
Double plug construction.
Very low capacitance.
Very fast switching speeds with minimal reverse recovery times.
JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
MSP screening is also available in reference to MIL-PRF-19500 (JANS).
(See part nomenclature for all available options.)
RoHS compliant version available (commercial grade only).
APPLICATIONS / BENEFITS
High frequency data lines.
Small size for high density mounting using flexible thru-hole leads (see package illustration).
RS-232 & RS–422 interface networks.
Ethernet 10 base T.
Low capacitance steering or blocking.
LAN.
Computers.
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
DO-35 (DO-204AH)
Package
Also available in:
DO-213AA package
(surface mount)
1N4148UR-1
UB package
(surface mount)
1N4148UB
UB2 package
(2-Pin surface mount)
1N4148UB2
UBC package
(Ceramic Lid surface mount)
1N4148UBC
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead (1)
Thermal Resistance Junction-to-Ambient (2)
Maximum Breakdown Voltage
Working Peak Reverse Voltage
Average Rectified Current @ TA = 75 ºC (3)
Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms)
Symbol
TJ & TSTG
RӨJL
RӨJA
V(BR)
VRWM
IO
IFSM
Value
-65 to +175
250
325
100
75
200
2
Unit
oC
oC/W
oC/W
V
V
mA
A (pk)
NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves.
2. TA = +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu,
horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance
condition included, is measured at IO = 200 mA.
3. See Figure 1 for derating.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0281, Rev. 1 (121567)
©2012 Microsemi Corporation
Page 1 of 4


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