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PDF ISL8200MM Data sheet ( Hoja de datos )
| Número de pieza | ISL8200MM | |
| Descripción | Complete Current Share 10A DC/DC Power Module | |
| Fabricantes | Intersil | |
| Logotipo |  |
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NOT RECOMMENDED FOR NEW DESIGNS
RECOMMENDED REPLACEMENT PART
ISL8200AM
DATASHEET
Complete Current Share 10A DC/DC Power Module
ISL8200MM
The ISL8200MMREP is a simple and easy to use high power,
current-sharing DC/DC power module for
Datacom/Telecom/FPGA power hungry applications. All that is
needed is the ISL8200MMREP, a few passive components and
one VOUT setting resistor to have a complete 10A design ready
for market.
The ease of use virtually eliminates the design and
manufacturing risks while dramatically improving time to
market.
Need more output current? Just simply parallel up to six
ISL8200MMREP modules to scale up to a 60A solution (see
Figure 6 on page 10).
The simplicity of the ISL8200MMREP is in its “Off The Shelf”,
unassisted implementation. Patented current sharing in multi-
phase operation greatly reduces ripple currents, BOM cost and
complexity. For example, parallel 2 for 20A and up to 6 for 60A.
The output voltage can be precisely regulated to as low as 0.6V
with ±1% output voltage regulation over line, load, and
temperature variations.
The ISL8200MMREP’s thermally enhanced, compact QFN
package, operates at full load and over-temperature, without
requiring forced air cooling. It's so thin it can even fit on the back
side of the PCB. Easy access to all pins with few external
components, reduces the PCB design to a component layer and a
simple ground layer.
Features
• Specifications per DLA VID V62/10608
• Full mil-temp electrical performance from -55°C to +125°C
• Full traceability through assembly and test by date/trace code
assignment
• Enhanced process change notification
• Enhanced obsolescence management
• Complete switch mode power supply in one package
• Patented current share architecture reduces layout sensitivity
when modules are paralleled
• Programmable phase shift (1, 2, 3, 4, and 6 phase)
• Extremely low profile (2.2mm height)
• Input voltage range +3.0V to +20V at 10A, current share up to
60A
• A Single resistor sets VOUT from +0.6V to +6V
• Output overvoltage, overcurrent and over-temperature, built-in
protection and undervoltage indication
Applications
• Servers, telecom and datacom applications
• Industrial and medical equipment
• Point of load regulation
Related Literature
• iSim Model - (See Product Information page ISL8200MM)
Complete Functional Schematic
VIN RANGE
4.5V TO 20V
VIN
PVIN
VEN EN
FF
VOUT
ISL8200MMREP
Power Module
VOUT_SET
VSEN_REM-
VOUT RANGE
0.6V TO 6.0V
RSET
ISHARE
PGND1
10 F
5k
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT RSET FOR THE
DESIRED VOUT
ISL8200MMREP Package
2.2mm
15mm
15mm
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE OF
PCBS WHEN SPACE AND HEIGHT IS A PREMIUM
March 15, 2013
FN7690.2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2010, 2011, 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL8200MM
Pin Descriptions (Continued)
PIN
NUMBER
PIN
NAME
PIN DESCRIPTION
23 NC Not internally connected.
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PHASE thermal pad. Potential should be floating and
not electrically connected to anything except PHASE pin.
PD2 VIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the VIN thermal pad. Potential should be floating and
not electrically connected to anything except VPVIN pin.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PGND thermal pad. Potential should be floating and
not electrically connected to anything except PGND pin.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the VOUT thermal pad. Potential should be floating and
not electrically connected to anything except VOUT pin.
Typical Application Circuits
VIN
GND
ISISUILSL2L88082212000000MMMMMRREPEP
R1
16. 5k
C IN (CE R)
PVIN
VIN
R2
4. 12k
C EN
1nF
FF
EN
* Select R1 & R2
such that
0.8V<VEN<5.0V
IS F ETD RV 1
F SY NC_IN
C LKOU T
I SH AR E_BU S
I SF E TD R V
VOU T
VOU T
GND
2. 2k
R SE T
C OU T
VOU T_S ET
VSE N_R EM-
PGOOD
PH _C NTR L
VC C
PGOOD1
(See Table 1,
VOUT - RSET on page 13)
R ISH AR E
5k
C PVC C
10uF
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
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5
FN7690.2
March 15, 2013
5 Page 
ISL8200MM
Typical Performance Characteristics (Continued)
Transient Response Performance
TA = +25°C, PVIN = VIN = 12V, CIN = 220µFx1, 10µF/Ceramic x 2, COUT = 47µF/Ceramic x 8
IOUT = 0A to 5A, Current slew rate = 2.5A/µs
VOUT
IOUT
VIN = 12V
VOUT = 1.5V
IOUT = 0A to 5A
VOUT
IOUT
VIN = 12V
VOUT = 1.8V
IOUT = 0A to 5A
FIGURE 10. 1.5V TRANSIENT RESPONSE
VOUT
IOUT
VIN = 12V
VOUT = 2.5V
IOUT = 0A to 5A
FIGURE 11. 1.8V TRANSIENT RESPONSE
VOUT
IOUT
VIN = 12V
VOUT = 3.3V
IOUT = 0A to 5A
FIGURE 12. 2.5V TRANSIENT RESPONSE
FIGURE 13. 3.3V TRANSIENT RESPONSE
Submit Document Feedback 11
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March 15, 2013
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet ISL8200MM.PDF ] | |
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