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PDF ISL8200AMM Data sheet ( Hoja de datos )
| Número de pieza | ISL8200AMM | |
| Descripción | Complete Current Share 10A DC/DC Power Module | |
| Fabricantes | Intersil | |
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DATASHEET
Complete Current Share 10A DC/DC Power Module
ISL8200AMM
The ISL8200AMMREP is a simple and easy to use high
power, current-sharing DC/DC power module for
Datacom/Telecom/FPGA power hungry applications. All that
is needed is the ISL8200AMMREP, a few passive
components and one VOUT setting resistor to have a
complete 10A design ready for market.
The ease of use virtually eliminates the design and
manufacturing risks while dramatically improving time to
market.
Need more output current? Parallel up to six ISL8200AMMREP
modules to scale up to a 60A solution.
The simplicity of the ISL8200AMMREP is in its "Off The Shelf",
unassisted implementation versus a discrete implementation.
Patented current sharing in multi-phase operation greatly
reduces ripple currents, BOM cost and complexity. For
example, parallel 2 for 20A and up to 6 for 60A. The output
voltage can be precisely regulated to as low as 0.6V with ±1%
output voltage regulation over line, load, and temperature
variations.
The ISL8200AMMREP’s thermally enhanced, compact QFN
package, operates at full load and over-temperature, without
requiring forced air cooling. It's so thin it can even fit on the
back side of the PCB. Easy access to all pins with few external
components, reduces the PCB design to a component layer
and a simple ground layer.
Features
• Specifications per DLA VID V62/10608
• Complete Switch Mode Power Supply in One Package
• Patented Current Share Architecture Reduces Layout
Sensitivity when Modules are Paralleled
• Programmable Phase Shift (1 to 6 Phase)
• Extremely Low Profile (2.2mm Height)
• Input Voltage Range +3.0V to +20V at 10A, Current Share
up to 60A
• A Single Resistor Sets VOUT from +0.6V to +6V
• Output Overvoltage, Overcurrent and Over-Temperature
Protection and Undervoltage Indication
• Full Mil-Temp Electrical Performance from -55°C to +125°C
• Full Traceability Through Assembly and Test by Date/Trace
Code Assignment
• Enhanced Process Change Notification
• Enhanced Obsolescence Management
Applications
• Servers, Telecom and Datacom Applications
• Industrial and Medical Equipment
• Point of Load Regulation
Related Literature
• AN1738 “ISL8200AMEV1PHZ Evaluation Board User’s
Guide”
• ISL8200AMMREP iSim Model - (Product Information Page)
Complete Functional Schematic ISL8200AMMREP Package
VIN = 4.5V TO 20V
PVIN = 3V TO 20V
PVIN
VIN
VOUT
ISL8200AMMREP
POWER MODULE
EN VOUT_SET
FF VSEN_REM-
V0UT =
0.6V TO 6.0V
RSET
ISHARE
PGND1
10µF
5k
NOTE: For input voltage higher than 4.5V, VIN can be tied to PVIN directly
(see Figure 22 for details).
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT RSET FOR
THE DESIRED VOUT
2.2mm
15mm
15mm
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE
OF PCBS WHEN SPACE AND HEIGHT ARE PREMIUM
June 3, 2015
FN8287.2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas LLC 2012, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL8200AMM
Pin Descriptions (Continued)
PIN # PIN NAME
PIN DESCRIPTION
23 NC Not internal connected
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using vias. Connect this
pad to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE pin 16.
PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN pin 17.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND pin 18.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT pin 19.
Typical Application Circuits
PVIN
GROUND
ISFETDRV1
PVIN
VIN
FF
EN
FSYNC_IN
VOUT
VOUT_SET
VSEN_REM-
ISL8200AMMREP
PGOOD
CLKOUT
ISHARE_BUS
ISFETDRV
PH_CNTRL
VCC
RSET
2.2k
PGOOD
VCC
VOUT
VOUT
GROUND
SET R1 AND R2 SUCH THAT
0.8V ≤ VEN ≤ 5.0V
DO NOT TIE EN DIRECTLY TO A POWER SOURCE
RSET CAN CHANGE VOUT
REFER TO TABLE 1
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
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June 3, 2015
5 Page 
ISL8200AMM
Typical Performance Characteristics (Continued)
VOUT
VIN = 12V
VOUT = 2.5V
IOUT = 0A TO 5A
VOUT
VIN = 12V
VOUT = 1.8V
IOUT = 0A TO 5A
FIGURE 12. 2.5V TRANSIENT RESPONSE
FIGURE 13. 3.3V TRANSIENT RESPONSE
PHASE1-M
PHASE2-M
PHASE3-M
PHASE4-S
FIGURE 14. FOUR MODULE CLOCK SYNC (VIN = 12V)
Submit Document Feedback 11
FN8287.2
June 3, 2015
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet ISL8200AMM.PDF ] | |
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