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PDF MC54HCT574A Data sheet ( Hoja de datos )
| Número de pieza | MC54HCT574A | |
| Descripción | Octal 3-State Noninverting D Flip-Flop | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal 3-State
Noninverting D Flip-Flop with
LSTTL-Compatible Inputs
High–Performance Silicon–Gate CMOS
The MC54/74HCT574A is identical in pinout to the LS574. This device
may be used as a level converter for interfacing TTL or NMOS outputs to
High Speed CMOS inputs.
Data meeting the setup time is clocked to the outputs with the rising
edge of the Clock. The Output Enable input does not affect the states of
the flip–flops, but when Output Enable is high, all device outputs are
forced to the high–impedance state. Thus, data may be stored even when
the outputs are not enabled.
The HCT574A is identical in function to the HCT374A but has the
flip–flop inputs on the opposite side of the package from the outputs to
facilitate PC board layout.
• Output Drive Capability: 15 LSTTL Loads
• TTL NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 µA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 286 FETs or 71.5 Equivalent Gates
LOGIC DIAGRAM
DATA
INPUTS
D0 2
D1 3
D2 4
D3 5
D4 6
D5 7
D6 8
D7 9
19 Q0
18 Q1
17 Q2
16 Q3
15 Q4
14 Q5
13 Q6
12 Q7
NON–
INVERTING
OUTPUTS
CLOCK 11
OUTPUT ENABLE 1
PIN 20 = VCC
PIN 10 = GND
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎDesign Criteria
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎInternal Gate Count*
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎInternal Gate Propagation Delay
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎInternal Gate Power Dissipation
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎSpeed Power Product
Value Units
71.5 ea
1.5 ns
5.0 µW
0.0075 pJ
* Equivalent to a two–input NAND gate.
MC54/74HCT574A
20
1
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
20
1
20
1
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
ORDERING INFORMATION
MC54HCTXXXAJ Ceramic
MC74HCTXXXAN Plastic
MC74HCTXXXADW SOIC
PIN ASSIGNMENT
OUTPUT
ENABLE
D0
D1
1
2
3
20 VCC
19 Q0
18 Q1
D2 4
17 Q2
D3 5
D4 6
D5 7
16 Q3
15 Q4
14 Q5
D6 8
13 Q6
D7 9
GND 10
12 Q7
11 CLOCK
FUNCTION TABLE
Inputs
Output
OE Clock D
Q
L
L
L L,H,
HX
HH
LL
X No Change
XZ
X = don’t care
Z = high impedance
3/97
© Motorola, Inc. 1997
3–1
REV 7
1 page  
MC54/74HCT574A
20
1
A
F
H
D
SEATING
PLANE
–A–
20
1
–T–
SEATING
PLANE
E
GF
11
10
B
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
ISSUE E
CL
N
K
G
J
M
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 23.88 25.15 0.940 0.990
B 6.60 7.49 0.260 0.295
C 3.81 5.08 0.150 0.200
D 0.38 0.56 0.015 0.022
F 1.40 1.65 0.055 0.065
G 2.54 BSC
0.100 BSC
H 0.51 1.27 0.020 0.050
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L 7.62 BSC
0.300 BSC
M 0_ 15_ 0_ 15_
N 0.25 1.02 0.010 0.040
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
11 ISSUE E
B
10
CL
K
N
D 20 PL
0.25 (0.010) M T A M
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
DW SUFFIX
–A–
20 11
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 10X P
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
1 10
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D
0.010 (0.25) M T A S B S
J
F
18X G
C
–T–
SEATING
PLANE
K
M
R X 45_
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5
MOTOROLA
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| PDF Descargar | [ Datasheet MC54HCT574A.PDF ] | |
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