LE2416RDXA Datasheet PDF - ON Semiconductor
Part Number | LE2416RDXA | |
Description | EEPROM | |
Manufacturers | ON Semiconductor | |
Logo | ||
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16 kb I2C CMOS Serial EEPROM
Overview
The LE2416RDXA is two-wire serial interface EEPROM (Electrically
Erasable and Programmable ROM). This device realizes high speed and a
high level reliability by high performance CMOS EEPROM technology.
This device is compatible with I2C memory protocol, therefore it is best
suited for application that requires re-writable nonvolatile parameter
memory.
www.onsemi.com
Function
Capacity : 16k bits (2k 8 bits)
Single supply voltage : 1.7 V to 3.6 V
Operating temperature : 40 ºC to +85 ºC
WLCSP6, 0.80x1.20
Interface : Two wire serial interface (I2C Bus*)
Operating clock frequency : 400 kHz (Fast), 1000 kHz (Fast-Plus)
Low Power consumption
: Standby : 2 µA (max.)
: Active (Read, 400 kHz) : 0.5 mA (max.)
Active (Read, 1000 kHz) : 2.0 mA (max.)
Automatic page write mode : 16 Bytes
Read mode : Sequential Read and random read
Erase/Write cycles : 106 cycles (Page Write)
Data Retention : 20 years
Pull-up resistance: 5 kΩ (typ.) on WP pin with a built-in pull-up resister
High reliability : Adopts proprietary symmetric memory array configuration (USP6947325)
Hardware write protect feature
Noise filters connected to SCL and SDA pins
Incorporates a feature to prohibit write operations under low voltage conditions.
Package : LE2416RDXA WLP6(0.801.20) 0.33 mm height
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter
Supply voltage
Symbol
DC input voltage
Over-shoot voltage
Storage temperature
Tstg
Conditions
Ratings
0.5 to +4.6
0.5 to VDD+0.5
1.0 to VDD+1.0
65 to +150
Unit
V
V
V
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
* This product is licensed from Silicon Storage Technology, Inc. (USA).
ORDERING INFORMATION
See detailed ordering and shipping information on page 17 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
August 2016 - Rev. 1
1
Publication Order Number :
LE2416RDXA/D
|
|
Package Dimensions
unit : mm
WLCSP6, 0.80x1.20
CASE 567HM
ISSUE O
LE2416RDXA
PIN A1
REFERENCE
E
2X 0.05 C
2X 0.05 C TOP VIEW
AB
D
0.05 C
0.08 C
NOTE 3
SIDE VIEW
A
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.33
A1 0.03 0.13
b 0.15 0.25
D 0.80 BSC
E 1.20 BSC
e 0.40 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.40
PITCH
PACKAGE
OUTLINE
6X b
0.05 C A B
0.03 C
e
e
B
A
123
BOTTOM VIEW
0.40
PITCH
6X
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
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Information | Total 17 Pages | |
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